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필름 인서트 사출성형 평판의 휨 변형에 관한 실험적 연구

An Experimental Study on the Warpage of a Film Insert Molded Plate

  • 유영길 (충주대학교 대학원) ;
  • 이호상 (충주대학교 항공기계설계학과)
  • 투고 : 2011.09.30
  • 심사 : 2011.11.30
  • 발행 : 2012.02.01

초록

FIM(Film Insert Molding) is an innovative method of producing decorated parts for a wide range of products. Because it requires fewer steps when compared to conventional production methods, the time and cost of manufacturing high quality components can be reduced considerably. In this paper, the effects of processing conditions on the warpage of film-insert molded plate were investigated by using a design of experiments. The dominant factors affecting warpage were mold temperature and holding pressure. Warpage increased with the temperature difference between stationary mold and fixed one. Even when the mold temperature difference was zero, the plate with a film was bent after ejection such that the film side protruded. As holding pressure increased, warpage decreased significantly. In addition warpage increased with time increment for the film-insert molded plates.

키워드

참고문헌

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