Journal of the Semiconductor & Display Technology (반도체디스플레이기술학회지)

The Korean Society Of Semiconductor & Display Technology (한국반도체디스플레이기술학회)
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Temperature Uniformity Control of Wafer During Vacuum Soldering Process

진공 솔더링 공정 중 웨이퍼 온도균일화 제어

  • Received : 2012.06.01
  • Accepted : 2012.06.15
  • Published : 2012.06.30
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Abstract

As decreasing size of chips, the need of wafer level packaging is increased in semi-conductor and display industries. Temperature uniformity is a crucial factor in vacuum soldering process to guarantee quality of bonding between chips and wafer. In this paper, a stepwise iterative algorithm has been suggested to obtain output profile of each heat source. Since this algorithm is based on open-loop stepwise iterative experimental technique, it is easier to implement and cost effective than real time feedback controls. Along with some experiments, it was shown that the suggested algorithm can remarkably improve temperature uniformity of wafer during whole heating process compared with the ordinary manual trial-and error method.

Keywords

References

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