Journal of the Semiconductor & Display Technology (반도체디스플레이기술학회지)

The Korean Society Of Semiconductor & Display Technology (한국반도체디스플레이기술학회)
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The Conduction Properties of Epoxy Resin Composition According to the Content Change of Spherical Hollow Type Silver

중공형 구형 은입자의 함량변화에 따른 에폭시 수지조성물의 전도특성 연구

  • Kim, Whan Gun (Department of Chemical and Biological Engineering, Seokyeong University) ;
  • Lim, Ryun Woo (Department of Chemical and Biological Engineering, Seokyeong University)
  • 김환건 (서경대학교 화학생명공학과) ;
  • 임륜우 (서경대학교 화학생명공학과)
  • Received : 2012.05.16
  • Accepted : 2012.06.15
  • Published : 2012.06.30
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Abstract

The monodispersed polystyrene spheres were prepared by emulsion polymerization in aqueous alcohol system. They coated with silver by reduction of silver ion percolated on the surface of them. The spherical hollow type silver has been prepared by dissolving polystyrene with toluene. Epoxy resin compositions with spherical hollow type silver were manufactured, which were composed of a bisphenol F type epoxy resin (RE-304S), amine type hardener (Kayahard AA), and 1-benzyl 2-methyl imidazole (1B2MI) as catalyst. The electrical conductivity with silver content ratio were investigated after cure, the percolation threshold weight ratio for conductance in this epoxy resin system was obtained above the 70 wt% of silver.

Keywords

References

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