DOI QR코드

DOI QR Code

Reliability Evaluation of COTS Integrated Circuits for Military and Space Applications

우주, 군 응용을 위한 상업용 집적회로부품의 신뢰성 평가

  • Chan, Sung-Il (Components & Materials Physics Research Center, Korea Electronics Technology Institute) ;
  • Han, Chang-Woon (Components & Materials Physics Research Center, Korea Electronics Technology Institute)
  • Received : 2012.08.30
  • Accepted : 2012.11.19
  • Published : 2012.12.01

Abstract

Commercial Off the Shelf(COTS) Integrated circuits(ICs) are being increasingly considered for use in space and military applications. Therefore, There is a need to implement standard tests and requirements to ensure reliability of COTS ICs. This paper presents an overview of the ICs screen procedure and methods under the European Cooperation for Space Standardization (ECSS) and Tests Method Standard Microcircuits (MIL-STD-883). We describes the COTS ICs screen test guidelines that are mainly focused after encapsulating. In addition, COTS linear bipolar IC is investigated to evaluate the reliability requirements. The experiment results showed that COTS IC is satisfied with high reliability requirements.

고 신뢰성을 요구하는 우주, 군 등과 같은 응용분야에 집적회로 사용에 대한 필요성이 증가하고 있다. 따라서 상업용(Commercial Off The Shelf) 집적회로부품에 대한 신뢰성 보증 요구조건과 실험규격에 대한 연구가 매우 필요하다. 본 연구에서는 ECSS(European Cooperation for Space Standardization) 품질규격과 MIL-STD-883(집적회로 시험방법)을 기초하여 상업용 집적회로부품의 신뢰성 검증(evaluation)을 위한 스크린(Screening) 실험방법을 검토하였다. 그리고 상업용 부품에 대한 스크린 시험절차와 검사방법을 제안하였다. 또한, 제안한 시험절차와 방법에 맞추어 상업용 Linear Bipolar 집적회로를 평가하였다. 시험결과 상업용 Linear Bipolar 제품이 고 신뢰성 활용을 위한 신뢰성 요구조건을 모두 만족하는 것을 확인하였다.

Keywords

References

  1. Vettraino, L.G., Risbud, S.H., "Current Trends in Military Microelectronic Component Packaging," IEEE Transactions on Components and Packaging Technologies, Vol. 22, 1999, pp.270-281. https://doi.org/10.1109/6144.774744
  2. Ja Min Koo, "A Study on Against Method of Project Management Step for Military Equipment DMSMS," The Graduate School of Kyunghee University, 2007.
  3. Condra, L., O'Rear, S., Freedman, T., Flancia, L., Pecht, M., Barker, D., "Comparison of Plastic and Hermetic Microcircuits under Temperature Cycling and Temperature Humidity Bias," IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol. 15, 1992, pp.640-650. https://doi.org/10.1109/33.180026
  4. Musiejovsky, L., Nicolics, J., Hauser, H., Brasseur, G., "Thermal Performance of Plastic-encapsulated and Hermetically Sealed Components for Automotive Applications," IEEE Instrumentation and Measurement Technology Conference, Vol. 2, 1998, pp.1185-1188.
  5. James T.H., "The Future of Components for High Reliability Military and Space Applications," Sandia National Laboratory, Albuquerque, 1996.
  6. INTEL, "Intel Quality System Handbook," 2009. from http://www.intel.com/design/quality
  7. Texas Instruments, "Texas Instruments Quality and Reliability Handbook," 2008. from http://focus.ti.com/quality
  8. MIL-STD-883G, "Test Method Standard Microcircuits," Department of Defense, 2006.
  9. EEE-INST-002, "Instructions for EEE Parts Selection, Screening, Qualification, and Derating," National Aeronautics and Space Administration, 2003.