DOI QR코드

DOI QR Code

A Study on Characteristics of ELID Lapping for Sapphire Wafer Material

사파이어 웨이퍼의 ELID 랩핑 가공 특성에 관한 연구

  • Kwak, Tae-Soo (Department of Mechanical Engineering, Gyeongnam National University of Science and Technology) ;
  • Han, Tae-Sung (Department of Mechanical Engineering, Gyeongnam National University of Science and Technology) ;
  • Jung, Myung-Won (Department of Mechanical Engineering, Gyeongnam National University of Science and Technology) ;
  • Kim, Yunji (Materials Fabrication Laboratory, RIKEN) ;
  • Uehara, Yosihiro (Materials Fabrication Laboratory, RIKEN) ;
  • Ohmori, Hitoshi (Materials Fabrication Laboratory, RIKEN)
  • Received : 2012.10.16
  • Accepted : 2012.10.23
  • Published : 2012.12.01

Abstract

This study has been focused on application of ELID lapping process for mirror-surface machining of sapphire wafer. Sapphire wafer is a superior material with optic properties of high performance as light transmission, thermal conductivity, hardness and so on. High effective surface machining technology is necessary to use sapphire as various usages. The interval ELID lapping process has been set up for lapping of the sapphire material. According to the ELID lapping experimental results, it shows that 12.5 kg of load for lapping is most pertinent to ELID lapping. the surface of sapphire can be eliminated by metal bonded wheel with micron abrasives and the surface roughness of 60 nmRa can be gotten using grinding wheel of 2,000 mesh in 4.5 um, depth of cut. In this study, the chemical experiments after ELID grinding also has been conducted to check chemical reaction between workpiece and grinding wheel on ELID grinding process. It shows that the chemical reaction has not happened as the results of the chemical experiments.

Keywords

References

  1. Kim, D., Kim, H., Lee, T., and Jung, H., "Analysis of Stress Non-uniformity on Sapphire Wafer during Diamond Mechanical Polishing," Proc. of KSPE Spring Conference, pp. 263-264, 2011.
  2. Kwak, J., Kim, G., Lee, Y., Ohmori, H., and Kwak, T., "Properties of ELID Mirror-Surface Grinding for Single Crystal Sapphire Optics," J. of the KSPE, Vol. 29, No. 3, pp. 247-252, 2010. https://doi.org/10.7736/KSPE.2012.29.3.247
  3. Ohmori, H. and Nakagawa, T., "Mirror Surface Grinding of Silicon Wafer with Electrolytic Inprocess Dressing," CIRP Annals - Manufacturing Technology, Vol. 39, No. 1, pp. 329-332, 1990. https://doi.org/10.1016/S0007-8506(07)61065-8
  4. Ohmori, H. and Nakagawa, T., "Analysis of Mirror Surface Generation of Hard and Brittle Materials by ELID (Electrolytic In-Process Dressing) Grinding with Superfine Grain Metallic Bond Wheels," CIRP Annals - Manufacturing Technology, Vol. 44, No. 1, pp. 287-290, 1995. https://doi.org/10.1016/S0007-8506(07)62327-0
  5. Dai, Y., Ohmori, H., Watanabe, Y., Eto, H., Lin, W., and Suzuki, T., "Subsurface Properties of Ceramics for Lightweight Mirrors after ELID Grinding," JSME International Journal Series C, Vol. 47, No. 1, pp. 66-71, 2004. https://doi.org/10.1299/jsmec.47.66
  6. Kwak, T. S. and Ohmori, H., "Nano-Level Mirror Surface Machining Technology for SiC Ceramics Mirror," J. of the KSPE, Vol. 23, No. 6, pp. 29-36, 2006.

Cited by

  1. The Effect of Pressure and Platen Speed on the Material Removal Rate of Sapphire Wafer in the CMP Process vol.32, pp.2, 2016, https://doi.org/10.9725/kstle.2016.32.2.67