References
- S.C. Johnson, "Flip-Chip Packaging Becomes Competitive," Semiconductor Int., May 2009.
- R. Lathrop, "Semiconductor Packaging Solutions Utilizing Fine Powder Solder Paste," Proc. Int. Wafer-Level Packaging Conf., 2008, pp. 129-136.
- K.-S. Choi et al., "Novel Maskless Bumping for 3D Integration," ETRI J., vol. 32, no. 2, Apr. 2010, pp. 342-344. https://doi.org/10.4218/etrij.10.0209.0396
- Y.-S. Eom et al., "Characterization of Polymer Matrix and Low Melting Point Solder for Anisotropic Conductive Film," Microelectron. Eng., vol. 85, 2008, pp. 327-331. https://doi.org/10.1016/j.mee.2007.07.005
- Y.S. Eom et al., "Electrical Interconnection with a Smart ACA Composed of Fluxing Polymer and Solder Powder," ETRI J., vol. 32, no. 3, June 2009, pp. 414-421. https://doi.org/10.4218/etrij.10.0109.0400
- IPC Std. J-STD-005, "Requirements for Soldering Pastes."
- K.S. Jang et al., "Catalytic Behavior of Sn/Bi Metal Powder in Anhydride-Based Epoxy Curing," J. Nanosci. Nanotechnol., vol. 9, no. 12, 2009, pp. 7461-7466.
Cited by
- Novel Bumping and Underfill Technologies for 3D IC Integration vol.34, pp.5, 2011, https://doi.org/10.4218/etrij.12.0112.0104
- Novel Bumping Process for Solder on Pad Technology vol.35, pp.2, 2011, https://doi.org/10.4218/etrij.13.0212.0302
- Optimization of Material and Process for Fine Pitch LVSoP Technology vol.35, pp.4, 2011, https://doi.org/10.4218/etrij.13.1912.0007
- Fine-Pitch Solder on Pad Process for Microbump Interconnection vol.35, pp.6, 2011, https://doi.org/10.4218/etrij.13.0213.0284
- Maskless Screen Printing Process using Solder Bump Maker (SBM) for Low-cost, Fine-pitch Solder-on-Pad (SoP) Technology vol.20, pp.4, 2011, https://doi.org/10.6117/kmeps.2013.20.4.065
- Characterization of Fluxing and Hybrid Underfills with Micro-encapsulated Catalyst for Long Pot Life vol.36, pp.3, 2011, https://doi.org/10.4218/etrij.14.0113.0570
- Characterization and Estimation of Solder-on-Pad Process for Fine-Pitch Applications vol.4, pp.10, 2011, https://doi.org/10.1109/tcpmt.2014.2354049
- HV-SoP Technology for Maskless Fine-Pitch Bumping Process vol.37, pp.3, 2011, https://doi.org/10.4218/etrij.15.0114.0578
- Interconnection Technology Based on InSn Solder for Flexible Display Applications vol.37, pp.2, 2011, https://doi.org/10.4218/etrij.15.0114.0167
- Novel Low-Volume Solder-on-Pad Process for Fine Pitch Cu Pillar Bump Interconnection vol.22, pp.2, 2011, https://doi.org/10.6117/kmeps.2015.22.2.055
- Sn58Bi Solder Interconnection for Low-Temperature Flex-on-Flex Bonding vol.38, pp.6, 2011, https://doi.org/10.4218/etrij.16.0115.0945
- Characterization of transmission lines with through-silicon-vias and bump joints on high-resistivity Si interposers for RF three-dimensional modules vol.55, pp.6, 2016, https://doi.org/10.7567/jjap.55.06jc01