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Electronics and Telecommunications Research Institute (한국전자통신연구원)
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Characterization of a Hybrid Cu Paste as an Isotropic Conductive Adhesive

  • Eom, Yong-Sung (Convergence Components and Materials Research Laboratory, ETRI) ;
  • Choi, Kwang-Seong (Convergence Components and Materials Research Laboratory, ETRI) ;
  • Moon, Seok-Hwan (Convergence Components and Materials Research Laboratory, ETRI) ;
  • Park, Jun-Hee (LED Pack Co.) ;
  • Lee, Jong-Hyun (Department of Materials Science & Engineering, Seoul National University of Technology) ;
  • Moon, Jong-Tae (Convergence Components and Materials Research Laboratory, ETRI)
  • Received : 2010.09.01
  • Accepted : 2011.05.20
  • Published : 2011.12.31
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Abstract

As an isotropic conductive adhesive, that is, a hybrid Cu paste composed of Cu powder, solder powder, and a fluxing resin system, has been quantitatively characterized. The mechanism of an electrical connection based on a novel concept of electrical conduction is experimentally characterized using an analysis of a differential scanning calorimeter and scanning electron microscope energy-dispersive X-ray spectroscopy. The oxide on the metal surface is sufficiently removed with an increase in temperature, and intermetallic compounds between the Cu and melted solder are simultaneously generated, leading to an electrical connection. The reliability of the hybrid Cu paste is experimentally identified and compared with existing Ag paste. As an example of a practical application, the hybrid Cu paste is used for LED packaging, and its electrical and thermal performances are compared with the commercialized Ag paste. In the present research, it is proved that, except the optical function, the electrical and thermal performances are similar to pre-existing Ag paste. The hybrid Cu paste could be used as an isotropic conductive adhesive due to its low production cost.

Keywords

References

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