참고문헌
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- J.M. Koo, J.B. Lee, S.S. Ha, J.W. Kim, B.I. Noh, J.H. Moon, S.H. Won and S.B. Jung : Reliability Evaluation of Electronic Circuit Printed Using Metallic Ink, Journal of KWJS, 26-2 (2008), 139-144 (in Korean)
- M.J. Kang, B.Y. Kang, J.H. Kim and J.H. Kim : Trend and Vision of Micro Joining Technology, Journal of KWJS, 22-4 (2004), 303-307 (in Korean)
- Scientific Group Thermodata Europe (SGTE) alloy phase diagrams, http://www.sgte.org/ fact/documentation/SGTE/SGTE_Figs.htm
- I. Kawakatsu and S. Kitayama : Study on Diffusion Bonding of Metals, Trans. JIM, 18 (1977), 455-465 https://doi.org/10.2320/matertrans1960.18.455
- L. Meng, S.P. Zhou, F.T. Yang, Q.J. Shen and M.S. Liu : Diffusion Annealing of Copper-Silver Bimetallic Strips at Different Temperature, Mater. Charact., 47 (2001), 269-274 https://doi.org/10.1016/S1044-5803(01)00182-6
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- K.S. Kim, M. Hatamura, S. Yamaguchi and K. Suganuma : Curing Characteristics of Nano Paste for Fine Printed Circuits, Proc. 3rd Int. IEEE Conf. Polymers and Adhesives in Microelectronics and Photonics (Polytronics 2003), Monteux, Switzerland, (2003), 369-374