반도체디스플레이기술학회지 (Journal of the Semiconductor & Display Technology)

한국반도체디스플레이기술학회 (The Korean Society Of Semiconductor & Display Technology)
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초음파를 이용한 금속-유리 접합에 관한 연구

A Study on the Metal-Glass Bonding Using Ultrasonic

  • Jeong, An-Mok (Manufacturing System R&D Group, Korea Institute of Industrial Technology) ;
  • Jeon, Euy-Sik (Mechanical Engineering, Kongju National University) ;
  • Kim, Cheol-Ho (Manufacturing System R&D Group, Korea Institute of Industrial Technology)
  • 투고 : 2011.05.11
  • 심사 : 2011.06.15
  • 발행 : 2011.06.30
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초록

Ultrasonic welding is widely used in bonding of the same kind or dissimilar materials. The important variable of ultrasonic bonding is the bonding pressure, bonding time and applied amplitude energy. These variables have to be optimized in order to obtain the optimum bonding results. In this research, the important factor to optimal bonding between metal and glass were experimentally investigated by applying design of experiment.

키워드

참고문헌

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