References
- J. D. Wu, C. Y. Huang and C. C. Liao, "Fracture strength characterization and failure analysis of silicon dies", Microelectronics Reliab., 43(2), pp.269-277 (2003). https://doi.org/10.1016/S0026-2714(02)00314-1
- H. H. Jiun and G. Omar, "Effect of wafer thinning methods towards fracture strength and topography of silicon die", Microelectronics Reliab., 46(5), pp.836-645 (2006). https://doi.org/10.1016/j.microrel.2005.07.110
- Z. Chen, J. B. Han and N. X. Tan, "The strength of the silicon die in flip-chip assemblies", Journal of Electronic Packaging, 125, pp.115-119 (2003).
- C. Landesberger, G. Klink, G. Schwinn, and R. Aschenbrenner, "New dicing and thinning concept improves mechanical reliability of ultra thin silicon", IEEE Proc. Int. Symp. on Advanced Packaging Materials, Braselton, Georgia, pp.92-97 (2001).
- J. N. Calata, J. G. Bai, X. Liu, S. Wen and G. Q. Lu, "Three-dimensional packaging for power semiconductor devices and modules", IEEE Transactions on Advanced Packaging, 28(3), pp.404-412 (2005). https://doi.org/10.1109/TADVP.2005.852837
- P. A. Wang, "Industrial challenges for thin wafer manufacturing", IEEE Proceedings of the Fourth World Conference on Photovoltaic Energy Conversion, pp.1179-1182 (2006).
- N. M. Lellan, N. Fan, S. Liu, K. Lau and J. Wu, "Effect of wafer thinning condition on the roughness, morphology and fracture strength of silicon die", ASME J Electron. Packag., 126(1), pp.110-114 (2004). https://doi.org/10.1115/1.1647123
- G. Omar, N. Tamaldin, M. R. Muhamad, and T. C. Hock, "Correlation of silicon wafer strength to the surface morphology", IEEE, Semiconductor Electronics Proceedings ICSE International Conference, pp.147-151 (2000).
- M. Y. Tsai, and C. H. Chen, "Evaluation of test methods for silicon die strength", Microelectronics Reliab., 48(4), pp933-941 (2008). https://doi.org/10.1016/j.microrel.2008.03.003
- P. H. DeHoff, K. J. Anusavice , and P. W. Hathcock. "An evaluation of the four-point flexural test for metal-ceramic bond strength", J. Dent. Res., 61(9), pp.1066-1069 (1982). https://doi.org/10.1177/00220345820610090801
- J. Paul, B. Majeed, K. M. Razeeb, and J. Barton, "Statistical fracture modelling of silicon with varying thickness", Acta Materiallia, 54(15), pp.3991-4000 (2006). https://doi.org/10.1016/j.actamat.2006.04.032
- ASTM C 1161-02C, "Standard Test Method for Flexural Strength of Advanced Ceramic at Ambient Temperature" (1990).
- T. K. Woo, Y. H. Kim, H. S. Ahn, and S. I. Kim, "A study of reflectance of textured crystalline Si surface fabricated by using preferential aqueous etching and grinding processes(in Kor.)", J. Microelectron. Packag. Soc., 16(3), pp.61-65 (2009).
- M. K. Choi, and E. K. Kim, "Effect of Si wafer Ultra-thinning on the Silicon surface for 3D mtegration(in Kor.)", J. Microelectron. Packag. Soc., 15(2), pp63-67 (2008).
- Y. Desmond, R. Chong, W. E. Lee, B. K. Lim, "Mechanical characterization in failure strength of silicon dice", IEEE Inter. Society Conference on Thermal Phenomena, pp203-210 (2004).