Journal of Welding and Joining

The Korean Welding and Joining Society (대한용접접합학회)
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Cu Filling into TSV and Si Dice Stacking for 3 Dimension Packaging

3차원 실장을 위한 TSV의 Cu 충전 및 Si 칩 적층 기술

  • Published : 2011.06.30
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References

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