Journal of Sensor Science and Technology (센서학회지)

The Korean Sensors Society (한국센서학회)
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Etching Characteristics of Micro Blaster for MEMS Applications

MEMS 공정에 적용하기 위한 마이크로 블라스터 식각 특성

  • Cho, Chan-Seob (School of Electrical Engineering, Kyungpook National University) ;
  • Bae, Ig-Soon (College of Engineering, Graduate School, Kyungpook National University) ;
  • Lee, Jong-Hyun (School of Electronics Engineering, Kyungpook National University)
  • 조찬섭 (경북대학교 산업전자전기공학부) ;
  • 배익순 (경북대학교 산업대학원) ;
  • 이종현 (경북대학교 전자공학부)
  • Received : 2011.03.02
  • Accepted : 2011.05.09
  • Published : 2011.05.31
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Abstract

Abrasive blaster is similar to sand blaster, and effectively removes hard and brittle materials. Exiting abrasive blaster has applied to rough working such as deburring and rough finishing. As the need for machining of ceramics, semiconductor, electronic devices and LCD are increasing, micro abrasive blaster was developed, and became the inevitable technique to micromachining. This paper describes the performance of the micro blaster in MEMS process of glass and succeed in domestically producing complete micro blaster. Diameter of hole and width of line in this etching is 100 ${\mu}m$ ~ 1000 ${\mu}m$. Experimental results showed good performance in micro channel and hole in glass wafer. Therefore, this micro blaster could be effectively applied to the micro machining of semiconductor, micro PCR chip.

Keywords

References

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