Journal of the Korean Society of Manufacturing Technology Engineers (한국생산제조학회지)

The Korean Society of Manufacturing Technology Engineers (한국생산제조학회)
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A Study on Evaluation of Shear Strength for Pb-free Solder Joint with Ni-P/Au UBM

Ni-P/Au UBM을 갖는 Pb-free 솔더 접합부의 전단강도 평가에 관한 연구

  • 조성근 (전북대학교 대학원 정밀기계공학과) ;
  • 양성모 (전북대학교 기계시스템공학부) ;
  • 유효선 (전북대학교 기계시스템공학부)
  • Received : 2010.12.08
  • Accepted : 2011.01.31
  • Published : 2011.04.15
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Abstract

UBM(Under Bump Metallurgy) is very important for successful realization of Flip-Chip technology. In this study, it is investigated the interfacial reactions between various Sn-Ag solder alloys and Ni-P/Au UBM and Cu plate finish. It is also evaluated the shear strength by using the micro shear-punch test method for Sn-37Pb alloy, binary and ternary alloys of environment-friendly Pb-free solder alloys which are applied in the electronic packages. In terms of interfacial microstructure, the Pb-free solder joints have thicker IMCs than the Sn-Pb solder joints. The thickness of IMC is related to Reflow time. The IMC has been observed to grow with the increase in Reflow time. As a result of the shear test, in case of Max. shear strength, Pb-free solder showed the highest strength value and Sn-37Pb showed the lowest strength value 10 be generally condition of Reflow time.

Keywords

References

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