Journal of Welding and Joining

  • 제29권1호
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  • Pages.99-106
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  • 2011
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  • 2466-2232(pISSN)
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  • 2466-2100(eISSN)
대한용접접합학회 (The Korean Welding and Joining Society)
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SAC 305솔더와 ENIG 기판의 접합강도에 미치는 저주파 수소라디칼처리의 영향

Improvement of Solder Joint Strength in SAC 305 Solder Ball to ENIG Substrate Using LF Hydrogen Radical Treatment

  • 이아름 (부산대학교 하이브리드소재솔루션 협동과정) ;
  • 조승재 (부산대학교 하이브리드소재솔루션 협동과정) ;
  • 박재현 (포항산업과학연구원 분석평가본부) ;
  • 강정윤 (부산대학교 재료공학부)
  • Lee, Ah-Reum (National Core Research Center(NCRC) for Hybrid Material Solution, Pusan National University) ;
  • Jo, Seung-Jae (National Core Research Center(NCRC) for Hybrid Material Solution, Pusan National University) ;
  • Park, Jai-Hyun (Research Institute of Industrial Science & Technology) ;
  • Kang, Chung-Yun (Pusan National University)
  • 투고 : 2010.11.15
  • 심사 : 2011.01.11
  • 발행 : 2011.02.28
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초록

Joint strength between a solder ball and a pad on a substrate is one of the major factors which have effects on electronic device reliability. The effort to improve solder joint strength via surface cleaning, heat treatment and solder composition change have been in progress. This paper will discuss the method of solder ball joint strength improvement using LF hydrogen radical cleaning treatment and focus on the effects of surface treatment condition on the solder ball shear strength and interfacial reactions. In the joint without radical cleaning, voids were observed at the interface. However, the specimens cleaned by hydrogen-radical didn't have voids at the interface regardless of cleaning time. The shear strength between the solder ball and the pad was increased over 120%(about 800gf) when compared to that without the radical treatment (680gf) under the same reflow condition. Especially, at the specimen treated for 5minutes, ball shear strength was considerably increased over 150%(1150gf). Through the observation of fracture surface and cross-section microstructure, the increase of joint strength resulted from the change of fracture mode, that is, from the solder ball fracture to IMC/Ni(P) interfacial fracture. The other cases like radical treated specimen for 1, 3, 7, 9min. showed IMC/solder interfacial fracture rather than fracture in the solder ball.

키워드

참고문헌

  1. D. G. Kim, J. W. Kim, S. B. Jung : Effect of aging conditions on interfacial reaction and mechanical joint strength between Sn-3.0Ag-0.5Cu solder and Ni-P UBM, Materals Science and Engineering, B 121(2005), 204-210
  2. T. H. You, Y.S. Kim, W. G. Jung, J.T. Moon, H. M. Choe : Effect of surface finish on the fracture behavior of Sn-Ag-Cu solder joints during high-strain rate loading, Journal of Alloys and Compounds, 486 (2009), 242-245 https://doi.org/10.1016/j.jallcom.2009.07.085
  3. F. Cheng, F. Gao, H. Nishikawa, T. Takemoto : Interaction behavior between the additives and Sn in Sn-3.0Ag-0.5Cu-based solder alloys and the relevant joint solderability, Journal of Alloys and Compounds, 472 (2009), 530-534 https://doi.org/10.1016/j.jallcom.2008.05.017
  4. J. W. Yoon, B. I. Noh, S. B. Jung : Effects of third element and surface finish on interfacial reactions of Sn-Ag-xCu(or Ni)/(Cu or ENIG) solder joints, Journal of Alloys and Compounds, 506 (2010), 331-337 https://doi.org/10.1016/j.jallcom.2010.06.202
  5. Y.W.Lee, J.P.Jung : A study on the spreadability of Sn-8mass%Zn-3mass%Bi solder with Au plating thickness, Journal of the institute of industrial technology, 14 (2006), 26-29 (in Korean)
  6. B.Y No, S. B. Jung : Effet of plasma treatment on adhesion strength between underfill and substrate, The Korea institute of metals and materials conference, 2006, 13-15 (in Korean)
  7. Y. C. Sohn, J. Yu, S.K. Kang, D. Y. Shih, T. Y. Lee : Effect of intermetallics spalling on the mechanical behavior of electroless Ni(P)/Pb-free solder interconnection, Electronic components and technology conference, 2005, 83-88
  8. N. H. Kang, H. S. Na, S. J. Kim, C. Y. Kang : Alloy design of Zn-Al-Cu solder for ultra high temperatures, Journal of alloys and compounds, 467 (2009) 246-250 https://doi.org/10.1016/j.jallcom.2007.12.048
  9. S. J. Kim, K. S. Kim, S. S. Kim, C. Y. Kang, K. Suganuma : Characteristics of Zn-Al-Cu alloys for high temperature solder application, Materials Transactions, 49-7 (2008), 1531-1536 https://doi.org/10.2320/matertrans.MF200809
  10. T. Hagihara, T. Takeuchi, Y. Ohno, Fluxless flipchip bonding process using Hydrogen radical, 10th Electronics Packaging Technology conference, 2008, 595-600
  11. M. Suenaga, T. Kakamori, D. Hirakawa, Y. Ohno, T. Hagihara, J. Kagami, T. Takeuchi : Development of flux-free reflow soldering process using hydrogen radicals, Electronic components and technology conference, 2005, 710-715
  12. N. Hosoda, T. Suga : C3F8 plasma fluorination of lead free solders for fluxless soldering, Applied surface science, 227 (2004), 81-86 https://doi.org/10.1016/j.apsusc.2003.11.061
  13. S. M. Hong, C. S. Kang, J. P. Jung : Flux-free direct chip attachment of solder-bump flip chip by Ar+$H_2$ plasma treatment, Journal of electronic materials 31-10 (2002) 1104-1111 https://doi.org/10.1007/s11664-002-0049-z
  14. R. Deltshew, D. Hirsch, H. Neumann, T. Herzog, K. J. Wolter, M. Nowottnick, K. Wittke : Plasma treatment for fluxless soldering, Surface and coatings technology, 142-144 (2001), 803-807 https://doi.org/10.1016/S0257-8972(01)01181-1
  15. Y.T. Chin, P. K. Lam, H. K. Yow, T. Y. Tou : Investigation of mechanical shock testing of leadfree SAC solder joints in fine pitch BGA package, Microelectronics reliability, 48 (2008), 1079-7086 https://doi.org/10.1016/j.microrel.2008.04.003
  16. W. Liu, N. C. Lee: The Effects of Additives to SnAgCu Alloys on Microstructure and Drop Impact Reliability of Solder Joints, JOM Journal of the minerals, metals and materials society, 59-7 (2007), 26-31 https://doi.org/10.1007/s11837-007-0085-5
  17. Y.C. Sohn, J. Yu : Spalling of intermetallic compounds during the reaction between lead-free solders and eletroless Ni-P metallization, 2004 Materials Research Society, 2428-2436
  18. Seung wook Lee., "Cr, Ni and Cu removal from Si wafer by remote plasma-excited hydrogen." Journal of the Korean Vacuum Society, 10-2 (2001), 267-274
  19. M. J. Kim, S. Y. Cho, S. H. Kim, J. P. Jung, Lower Temperature Soldering of Capacitor Using Sn-Bi Coated Sn-3.5%Ag Solder, journal of the Korea Welding and Joining Society, 23-3 (2005), 61-67 (in Korean)
  20. J. H. Park, J. H. Lee, Y. S. Ahn, Standardization of Mechanical Test Method for Lead-Free Solder Paste - Shear Test Method for Chip Joint -, journal of the Korea Welding and Joining Society, 25-2 (2007), 37-42 (in Korean) https://doi.org/10.5781/KWJS.2007.25.2.037