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Array Lens and Pinhole-based Multi-Confocal Robot Vision System : Micro Bump Inspections in Wafer Level Packaging

배열 렌즈 및 핀홀 기반 다중 공초점 로봇 비젼 시스템 : 웨이퍼레벨 패키징의 마이크로 범프 검사응용

  • 김민영 (경북대학교 IT대학 전자공학부) ;
  • 김현우 (경북대 전자전기컴퓨터학부) ;
  • 이순걸 (경희대학교 기계공학과)
  • Published : 2011.02.28

Abstract

Keywords

References

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