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A Study on RGBY LED Light using a Vacuum Printing Encapsulation Systems Method

진공 프린팅 성형 인쇄법(VPES)을 이용한 R.G.B.Y(Red, Green, Blue, Yellow) LED 광원 연구

  • 장민석 (한국광기술원 반도체조명연구센터) ;
  • 김영우 (한국광기술원 LED 융합 연구센터) ;
  • 신기해 (한국광기술원 반도체명연구센터) ;
  • 박정욱 (한국광기술원 반도체조명 연구센터) ;
  • 홍진표 (한국광기술원 반도체조명 연구센터) ;
  • 송상빈 (한국광기술원 반도체조명 연구센터) ;
  • 김재필 (한국광기술원 반도체조명 연구센터)
  • Received : 2010.10.13
  • Accepted : 2011.01.03
  • Published : 2011.02.28

Abstract

In order to develop highly-integrated RGBY(Red, Green, Blue, Yellow) LED light, a high thermal radiation ceramic package was manufactured, and the encapsulation process was applied with a vacuum printing encapsulation system(VPES). After the completion of vacuum printing, the shape of the encapsulation layer could be controlled by heat treatment during the curing process, and the optical power became highly increased as the encapsulation layer approached a dome shape. The optical characteristics involved in a Correlated Color Temperature(CCT), a Color Rendering Index (CRI), and the efficiency of RGBY LED light were able to be identified by the experimental designing method. Regarding the characteristics of the white light of RGBY LED light, which were measured on the basis of the aforementioned optical characteristics, CRI posted 88, CCT recorded 5,720[$^{\circ}K$], and efficiency exhibited 52[lm/W]. The chip temperature of RGBY LEDs was below 55[$^{\circ}C$] when the consumption power of LED chips was 0.1[W] for the red, 0.3[W] for the green, 0.08[W] for the blue, and 0.24[W] for the yellow. Also, the thermal resistance of the highly-integrated RGBY LED light measured by T3Ster was 2.3[K/W].

Keywords

References

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