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비극성 a-GaN용 R-면 사파이어 기판의 제조

Fabrication of R-plane Sapphire wafer for Nonpolar a-plane GaN

  • 투고 : 2011.07.26
  • 심사 : 2011.09.20
  • 발행 : 2011.09.30

초록

초고휘도 비극성 a-GaN LED를 위한 양질의 R-면 사파이어 기판을 제조하기 위해 절단, 연마공정에 대해서 연구하였다. 사파이어는 이방성이 큰 물질로서 R-면과 c-면의 기계적인 특성의 차이에 의해 기판 제조공정 조건이 영향을 받으며, c-면에 비해서 R-면은 이방성 크며 각 결정학적인 면에서의 이방성은 연마공정에는 큰 영향을 미치지 않으나 절단공정에 큰 영향을 미치는 것으로 나타났다. R-면 잉곳의 절단방향이 a-flat에 대해 $45^{\circ}$인 경우에 절단이 가장 효과적으로 이루어졌으며 양호한 절단품질을 얻을 수 있었다. 기계적인 연마가 이루어지는 래핑과 DMP(Diamond mechanical polishing) 공정에서는 c-면 기판과 연마율이 큰 차이가 나타나지 않았으나, 화학반응이 수반되는 CMP(Chemical mechanical polishing) 공정에서는 c-면 기판의 연마율이 R-면 기판의 약 2배 이상 큰 값을 가졌으며, 이는 c-면의 수화반응층 형성에 의한 영향으로 보여진다.

We have studied on the slicing and polishing processes of R-plane sapphire wafers for the substrates of UHB nonpolar a-plane GaN LED. The fabrication conditions of the R-plane and c-plane wafers were influenced by the large anisotropic properties (mechanical properties) of the sapphire. The slicing process was more affected by the anisotropic properties of R-plane than the polishing process. When the slicing direction was $45^{\circ}$ to the a-flat, the slicing time was shorter and the quality of as-slicing wafers was better than the slicing direction of normal to the a-flat. The MRR(Material removal rate) of mechanical polishing processes such as lapping and DMP(Diamond mechanical polishing) did not show significant differences between the R-plane and c-plane. The MRR of the c-plane was about two times higher than that of R-planes at the CMP(Chemical mechanical polishing) process due to the formation of hydrolysis reaction layers on the surface of the c-plane.

키워드

참고문헌

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