실리콘 웨이퍼 생산공정용 왁스 스핀코팅장치 내 기류 특성에 대한 3차원 전산유동해석

A Three-Dimensional CFD Study on the Air Flow Characteristics in a Wax Spin Coater for Silicon Wafer Manufacturing

  • 김용기 (금오공과대학교 대학원 기계시스템공학과) ;
  • 김동주 (금오공과대학교 기계공학과) ;
  • 우마로프 알리세르 (금오공과대학교 대학원 기계공학과) ;
  • 김경진 (금오공과대학교 기계시스템공학과) ;
  • 박준영 (금오공과대학교 기계설계공학과)
  • 투고 : 2011.11.18
  • 심사 : 2011.12.06
  • 발행 : 2011.12.31

초록

Wax spin coating is a part of several wafer handling processes in the silicon wafer polishing station. It is important to ensure the wax layer free of contamination to achieve the high degree of planarization on wafers after wafer polishing. Three-dimensional air flow characteristics in a wax spin coater are numerically investigated using computational fluid dynamics techniques. When the bottom of the wax spin coater is closed, there exists a significant recirculation zone over the rotating ceramic block. This recirculation zone can be the source of wax layer contamination at any rotational speed and should be avoided to maintain high wafer polishing quality. Thus, four air suction ducts are installed at the bottom of the wax spin coater in order to control the air flow pattern over the ceramic block. Present computational results show that the air suction from the bottom is quite an effective method to remove or minimize the recirculation zone over the ceramic block and the wax coating layer.

키워드

참고문헌

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