한국기계가공학회지 (Journal of the Korean Society of Manufacturing Process Engineers)

  • 제10권3호
  • /
  • Pages.53-59
  • /
  • 2011
  • /
  • 1598-6721(pISSN)
  • /
  • 2288-0771(eISSN)
한국기계가공학회 (The Korean Society of Manufacturing Process Engineers)
권호 표지

휴대용 컴퓨터내의 이상유동 냉각시스템을 이용한 모사칩의 열성능에 관한 연구

A Study on Thermal Performance of Simulated Chip using a Two Phase Cooling System in a Laptop Computer

  • 박상희 (금오공과대학교 기계공학과) ;
  • 최성대 (금오공과대학교 지능기계공학과) ;
  • 투고 : 2011.03.10
  • 심사 : 2011.06.23
  • 발행 : 2011.06.30
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초록

In this study, a two-phase closed loop cooling system is desinged and tested for a laptop computer using a FC-72. The cooling system is characterized by a parametric study which determines the effects of existence of a boiling enhancement microstructure, initial system pressure, volume fill ratio of coolant and inclination angle of condenser on the thermal performance of the closed loop. Experimental data show the optium condition when the volume ratio of working fluid is 70%, the pump flowing is 6ml/min, and the inclination angle of condenser is $0^{\circ}$. This research shows the maximum values which can dissipate 33W of chip power with a chip temperature maintained at $95^{\circ}C$.

키워드

참고문헌

  1. Mochizuki, M., Saito, Y., Goto, K., Nguyen, T., Ho, P., Malcolm, M., Morando, M.P., 1997, "Hinged Heat Pipes for Cooling Notebook PCs" IEEE 13th SEMI-THERM Symposium, pp. 64-72.
  2. Pal, A., Joshi, Y., Beitelmal, M.H., Patel, C. D., and Wenger, T., 2002, "Design and Performance Evaluation of a Compact Thermosyphon", IEEE Transactions on Components and Packaging Technologies.
  3. Camil-Daniel Ghiu, and Joshi, Y., 2005, "Boiling Performance of Single-Layered Enhanced Structures", ASME, J. of Heat Transfer, Vol. 127, pp. 675-683. https://doi.org/10.1115/1.1924568
  4. Jiang, L., Mikkelsen, J., Koo, J.M., Huber, D., Yao, S., Zhang, L., Zhou, P., Maveety, J.G., Prasher, R., Santiago, J.G., Kenny, T.W., and Goodson, K.E., 2002, "Closed-Loop Electroosmotic Microchannel Cooling System for VLSI Circuits", IEEE Transactions on Components and Packaging Technologies, pp. 347-355.
  5. Condo, Y., 2003, "Innovation Technology in Electronic Equipment", 4th ASME/JSME Joint Fluid Eng. Conference.
  6. Park, S. H., Cho, N. H., and Choi, S. D., 2009, "A Study on Thermal Performance of Cooling System for Laptop Computer Using a Cold Plate", KSMPE, Vol. 8, No. 4, pp. 83-89.