• Proceedings of the KSME Conference
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• 2008.11b
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• pp.2043-2052
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• 2008

The increasing heat generation rates in CPU of notebook computers motivate a research on cooling technologies with low thermal resistance. This paper develops a closed-loop two-phase cooling system using a micropump to circulate a dielectric liquid(PF5060). The cooling system consists of an evaporator containing a boiling enhancement microstructure connected to a condenser with mini fans providing external forced convection. The cooling system is characterized by a parametric study which determines the effects of volume fill ratio of coolant, existence of a boiling enhancement microstructure and pump flow rates on thermal performance of the closed loop. Experimental data shows the optimal parametric values which can dissipate 33.9W with a film heater maintained at $95^{\circ}C$.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.10 no.3
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• pp.53-59
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• 2011

In this study, a two-phase closed loop cooling system is desinged and tested for a laptop computer using a FC-72. The cooling system is characterized by a parametric study which determines the effects of existence of a boiling enhancement microstructure, initial system pressure, volume fill ratio of coolant and inclination angle of condenser on the thermal performance of the closed loop. Experimental data show the optium condition when the volume ratio of working fluid is 70%, the pump flowing is 6ml/min, and the inclination angle of condenser is $0^{\circ}$. This research shows the maximum values which can dissipate 33W of chip power with a chip temperature maintained at $95^{\circ}C$.