과제정보
연구 과제 주관 기관 : 한국연구재단
참고문헌
- M. Laroussi, Plasma Process. Polym., 2, 391 (2005). https://doi.org/10.1002/ppap.200400078
- R. Brandenburg, J. Ehlbeck, M. Stieber, Th. von Woedtke, J. Zeymer, O. Schluter, and K. D. Weltmann, Contrib. Plasma Phys., 47, 72 (2007). https://doi.org/10.1002/ctpp.200710011
- K.‐D. Weltmann, R. Brandenburg, Th. Von Woedtke, J. Ehlbeck, R. Foest, M. Stieber, and E. Kindel, J. Phys. D : Appl. phys., 41, 194008 (2008). https://doi.org/10.1088/0022-3727/41/19/194008
- V. M. steelman, Aorn J., 55, 773 (1992). https://doi.org/10.1016/S0001-2092(07)69447-2
- M. Laroussi and X. Lu, Appl. Phys. Lett., 87, 113902 (2005). https://doi.org/10.1063/1.2045549
- H. Conrads and M. Schmidt, Plasma Sorces Sci. Technol., 9, 441 (2000). https://doi.org/10.1088/0963-0252/9/4/301
- N. S. J. Braithwaite, Plasma Sources Sci. Technol., 9, 517 (2000). https://doi.org/10.1088/0963-0252/9/4/307
- G. M. Sapers and G. F. Simmons, Food Tech., 52. 48 (1998).
- M. O. Balaban, A. G. Arreola, M. Marshall, A. Peplow, C. I. Wei, and J. Cornell, J. Food Sci., 56, 743 (1991). https://doi.org/10.1111/j.1365-2621.1991.tb05372.x
- H. Koinuma, H. Ohkubo, T. Hashimoto, K. Inomata, T. Shiraishi, A. Miyagana, and S. Hayashi, Appl. Phys. Lett., 60, 816 (1992). https://doi.org/10.1063/1.106527
- J. Janca, M. klima, P. Slavicek, and L. Zajickova, Suf. Coat. Technol., 116, 547 (1999).
- H. W. Lee, S. H. Nam, A. H. Mohamed, G. C. Kim, and J. K. Lee, Plasma Process. Polym., 7, 274 (2010). https://doi.org/10.1002/ppap.200900083
- K. Lee, K. Paek, W. T. Ju, and Y. Lee, J. Microbiol., 44, 269 (2006).
- D. S. Won, T. K. Kim, and W. G. Lee, Appl. Chem. Eng., 21, 98 (2010).