마이크로전자및패키징학회지 (Journal of the Microelectronics and Packaging Society)

  • 제18권2호
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  • Pages.11-15
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  • 2011
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  • 1226-9360(pISSN)
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  • 2287-7525(eISSN)
한국마이크로전자및패키징학회 (The Korean Microelectronics and Packaging Society)
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이종 소재 접합체의 흡습 질량 확산 해석

A Study of Hygroscopic Moisture Diffusion Analysis in Multimaterial System

  • 김용연 (충북대학교 기계공학부)
  • Kim, Yong-Yun (School of Mechanical Engineering, Chungbuk National University)
  • 투고 : 2011.04.26
  • 심사 : 2011.06.07
  • 발행 : 2011.08.31
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초록

폴리머의 흡습문제를 해석하기 위해 흡습확산 지배방정식과 열전달 방정식을 고찰하였다. 두 방정식의 동일 한 형식의 편미분방정식이기 때문에 상사의 법칙을 적용하여 물체가 등온 하중조건을 받고 있을 때 단일 매질의 확산문 제를 상용유한요소코드에 의해 수치적으로 해석하였다. 여러 소재로 구성된 매체는 흡습질량이 접착면에서 불연속 특성 을 갖기 때문에 확산해석에 상사법칙을 직접적으로 적용할 수 없으나 흡습관련 소재 특성이 온도만의 함수인 소재로 구 성된 매체에서 흡습확산 문제는 접착면에서 연속성을 가지고 있는 압력비를 고려함으로써 해석하였다. 실리콘-비전도성 수지 접합체의 측정된 흡습 변화량은 접합면을 경계조건으로 하고 단일 매체에 대한 해석 결과와 매우 근접한 결과를 보였으나, 복합체로 해석한 결과는 흡습시간이 경과할수록 점점 큰 오차가 발생하였다.

Heat transfer equation is first reviewed and then governing equation of moisture diffusion. Analogy scheme is applied to analysis the moisture absorption problem of polymers. It make possible to numerically analyze the diffusion problem for single medium by using commercial finite element code if it is under the isothermal loading condition. It is extended to special multimaterial system by introducing pressure ratio function, whose moisture characteristics of materials are proportional to temperature only. The weight changes of silicon-nonconductive-polymer joint model due to moisture absorption is measured and been very close to the numerical results as for single media with boundary condition with zero concentration, but yields numerical errors as for multisystem media.

키워드

참고문헌

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