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Investigation of Ni/Cu Solar Cell Using Selective Emitter and Plating

선택도핑에 도금법으로 Ni/Cu 전극을 형성한 태양전지에 관한 연구

  • 권혁용 (세종대학교 그린전략에너지기술연구소) ;
  • 이재두 (에스에너지) ;
  • 이해석 (신성솔라에너지) ;
  • 이수홍 (세종대학교 그린전략에너지기술연구소)
  • Received : 2011.09.30
  • Accepted : 2011.11.24
  • Published : 2011.12.01

Abstract

The use of plated front contact for metallization of silicon solar cell may alternative technologies as a screen printed and silver paste contact. This technologies should allow the formation of contact with low contact resistivity a high line conductivity and also reduction of shading losses. A selective emitter structure with highly dopes regions underneath the metal contacts, is widely known to be one of the most promising high-efficiency solution in solar cell processing. When fabricated Ni/Cu plating metallization cell with a selective emitter structure, it has been shown that efficiencies of up to 18% have been achieved using this technology.

Keywords

References

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