Reel-to-reel Deposition of $Y_2O_3$ Buffer Layer on Ni-W Metal Substrates by the RF-sputtering

RF-스퍼터링법을 이용하여 Ni-W 금속기판에 연속공정으로 증착된 $Y_2O_3$ 완충층 특성 연구

  • Chung, K.C. (Korea Institute of Materials Science) ;
  • Jeong, T.J. (Korea Institute of Materials Science) ;
  • Choi, G.C. (Korea Institute of Materials Science) ;
  • Kim, Y.K. (Korea Institute of Materials Science) ;
  • Wang, X.L. (Institute for Superconducting and Electronic Materials, Univ. of Wollongong) ;
  • Dou, S.X. (Institute for Superconducting and Electronic Materials, Univ. of Wollongong)
  • Received : 2010.03.08
  • Accepted : 2010.04.14
  • Published : 2010.04.30

Abstract

Reel-to-reel deposition of $Y_2O_3$ has been performed on Ni-5%W metal substrates using the RF-sputtering method. The epitaxial orientation of $Y_2O_3$ buffer layers to the base bi-axially textured substrate was well identified using ${\theta}-2{\theta}$, out-of-plane ($\omega$), and in-plane ($\phi$) scans in X-ray diffraction analysis. The optimization of $Y_2O_3$ seed layers in reel-to-reel fashion were investigated varying the deposition temperature, sputtering power, and pressure for its significant roles for the following buffer stacks and superconducting layers. $Y_2O_3$ were all grown epitaxially on bi-axially textured metal substrates at 380 watts and 5 mTorr in the temperature range of $600-740^{\circ}C$ with higher $Y_2O_3$ (400) intensities at ${\sim}710^{\circ}C$. It was found that the $\Delta\omega$ values were $1-2^{\circ}$ lower but the $\Delta\phi$ values were above $1^{\circ}$ higher than that of Ni-W substrates. As the sputtering power increased from 340 to 380 watts, $\Delta\omega$ and $\Delta\phi$ values showed decreased tendency. Even in the small window of deposition pressure of 3-7 mTorr, the $Y_2O_3$ (400) intensities increased and $\Delta\omega$ and $\Delta\phi$ values were reduced as sputtering pressure increased.

Keywords

References

  1. A. Malozemoff, S. Fleshler, M. Rupich, C. Thieme, X. Li, W. Zhang, A. Otto, J. Maguire, D. Folts, J. Yuan, H. Kraemer, W. Schmidt, M. Wohlfart, H. Neumuller, Supercond. Sci. Technol. 21 (2008) 034005. https://doi.org/10.1088/0953-2048/21/3/034005
  2. O. Tsukamoto, Phsica C 468 (2008) 1101. https://doi.org/10.1016/j.physc.2008.05.199
  3. K. Leonard, A. Goyal, S. Kang, K. Yarborough, D. Kroeger, Supercond. Sci. Technol. 17 (2004) 1295. https://doi.org/10.1088/0953-2048/17/11/010
  4. T. Aytug, J. Wu, B. Kang, D. Verebelyi, C. Cantoni, E. Specht, A. Goyal, M. Paranthaman, D. Christen, Physica C 340 (2000) 33. https://doi.org/10.1016/S0921-4534(00)01331-9
  5. M. Bhuiyan, M. Paranthaman, S. Kang, D. Lee, K. Salama, Physica C 422 (2005) 95. https://doi.org/10.1016/j.physc.2005.03.016
  6. M. Paranthaman, D. Lee, A. Goyal, E. Specht, P. Martin, X. Cui, J. Mathis, R. Feenstra, D. Christen, D. Kroeger, Supercond. Sci. Technol. 12 (1999) 319. https://doi.org/10.1088/0953-2048/12/5/313
  7. H. Kim, C. Park, R. Ko, D. Shi, J. Chung, H. Ha, Y. Park, K. Song, D. Youm, Physica C 426-431 (2005) 926. https://doi.org/10.1016/j.physc.2005.02.085
  8. A. Goyal, R. Feenstra, M. Paranthaman, J. Thompson, B. Kang, C. Cantoni, D. Lee, F. List, P. Martin, E. Lara-Curzio, C. Stevens, D. Kroeger, M. Kowalewski, E. Specht, T. Aytug, S. Sathyamurthy, R. Williams, R. Ericson, Physica C 382 (2002) 251. https://doi.org/10.1016/S0921-4534(02)00626-3
  9. T. Aytug, J. Wu, B. Kang, D. Verebelyi, C. Cantoni, E. Specht, A. Goyal, M. Paranthaman, D. Christen, Physica C 340 (2000) 33. https://doi.org/10.1016/S0921-4534(00)01331-9
  10. T. Haugan, P. Barnes, T. Campbell, A. Goyal, A. Gapud, L. Heatherly, S. Kang, Physica C 425 (2005) 21. https://doi.org/10.1016/j.physc.2005.05.013
  11. W. Zhang, M. Rupich, U. Schoop, D. Verebelyi, C. Thieme, X. Li, T. Kodenkandath, Y. Huang, E. Siegal, D. Buczek, W. Carter, N. Nguyen, J. Schreiber, M. Prasova, J. Lynch, D. Tucker, S. Fleshler, Physica C 463-465 (2007) 505. https://doi.org/10.1016/j.physc.2007.04.239
  12. S. Kreiskott, M. Getta, B. Monter, H. Piel, N. Pupeter, Physica C 383 (2003) 306. https://doi.org/10.1016/S0921-4534(02)01986-X