DOI QR코드

DOI QR Code

전자 빔 조사를 통한 폴리카보네이트 표면개질 및 Cr박막 접착력 증대 효과

The Effect of Electron Irradiation on the Surface Modification of Polycarbonate and Adhesion of Cr Thin Films

  • 정철우 (울산대학교 첨단소재공학부) ;
  • 성영종 ((주)DH 기술연구소) ;
  • 임성열 ((주)DH 기술연구소) ;
  • 신기욱 ((주)DH 기술연구소) ;
  • 신창호 (울산대학교 첨단소재공학부) ;
  • 김선광 (울산대학교 첨단소재공학부) ;
  • 김준호 (울산대학교 첨단소재공학부) ;
  • 유용주 (울산대학교 첨단소재공학부) ;
  • 김대일 (울산대학교 첨단소재공학부)
  • Jeong, C.W. (School of Materials Science and Engineering, University of Ulsan) ;
  • Sung, Y.J. (DH Co., Ltd) ;
  • Lim, S.Y. (DH Co., Ltd) ;
  • Shin, G.W. (DH Co., Ltd) ;
  • Shin, C.H. (School of Materials Science and Engineering, University of Ulsan) ;
  • Kim, S.K. (School of Materials Science and Engineering, University of Ulsan) ;
  • Kim, J.H. (School of Materials Science and Engineering, University of Ulsan) ;
  • You, Y.Z. (School of Materials Science and Engineering, University of Ulsan) ;
  • Kim, Dae-Il (School of Materials Science and Engineering, University of Ulsan)
  • 투고 : 2009.12.15
  • 심사 : 2009.12.21
  • 발행 : 2010.01.30

초록

The enhancement of adhesion for Cr film on polycarbonate (PC) substrate with electron irradiation treatment was considered. The electron treatment changes the contact angle of the PC substrates. As increase the electron energy from 300 eV to 900 eV, the contact angle decreases from $90^{\circ}$ to $60^{\circ}C$. It is supposed that electron treatment changes the chemical property of PC substrate into hydrophilic one. The micro surface roughness was also affected by electron treatment. The PC substrates irradiated with intense electron beam of 900 eV show the rougher surface than those of other PC substrates. Cr thin films deposited on the PC substrate treated with electron irradiation at 900 eV show the higher adhesion than that of the Cr thin film deposited untreated bare PC substrates.

키워드

참고문헌

  1. H. Hwang, H. Song, J. Kim, M. Song and Y. Kim : Kor. J. Mater. Res. 19 (2009) 457. https://doi.org/10.3740/MRSK.2009.19.9.457
  2. Y. Park, J. Kim and J. Lee : Kor. J. Mater. Res. 19 (2009) 68. https://doi.org/10.3740/MRSK.2009.19.2.068
  3. S. Lin, Y. Chen, C. Wang, P. Hsieh and S. Shih : Appl. Surf. Sci. 255 (2009) 3868. https://doi.org/10.1016/j.apsusc.2008.10.069
  4. A. Misiuk, B. Surma, I. V. Antonova and S. A. Smagulova : Vacuum, 77 (2005) 513. https://doi.org/10.1016/j.vacuum.2004.09.010
  5. H. Choi, D. Park, J. Kim, W. Choi, Y. Sohn, B. Song, J. Cho, and Y. Kim : J. Kor. Vac. Soc, 16 (2007) 79. https://doi.org/10.5757/JKVS.2007.16.2.079
  6. K. S. Bae, J. Eom, I. S. Lee, S. Kim, Y. Ko and D. W. Kim : J. Kor. lnst. Surf. Eng. 37 (2004) 5.
  7. J. S. Lee, J. W. Seok, G. W. Jang and Y. H. Beag : J. Kor. Vac. Soc, 18 (2009)1. https://doi.org/10.5757/JKVS.2009.18.1.001
  8. J. Rha, S. Kwon and Y. Jeong : The Korean Society of Mechanical Engineers, 30 (2006) 1335.