한국광학회지 (Korean Journal of Optics and Photonics)

  • 제21권3호
  • /
  • Pages.118-122
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  • 2010
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  • 1225-6285(pISSN)
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  • 2287-321X(eISSN)
한국광학회 (Optical Society of Korea)
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COB LED 램프 패키징 방열 특성과 신뢰성에 관한 연구

A Study on High Power LED Lamp Structures

  • 홍대운 (충남대학교 전자공학과 광파전자공학연구실) ;
  • 이성재 (충남대학교 전자공학과 광파전자공학연구실)
  • Hong, Dae-Woon (Electronics Engineering Department, Chungnam National University) ;
  • Lee, Song-Jae (Electronics Engineering Department, Chungnam National University)
  • 투고 : 2010.02.09
  • 심사 : 2010.05.17
  • 발행 : 2010.06.25
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초록

절연층이 부분 제거된 MCPCB에 기반을 둔 변화된 COB 개념의 고출력 LED 램프 구조를 제안하였다. 제안된 구조의 경우, LED 소자와 금속 base 사이에 절연층이 제거됨에 따라 칩으로부터 발생된 열이 기판의 금속 base로 손쉽게 방출된다. 그 결과 제안된 구조의 LED 램프는, 열 시뮬레이션은 물론 광출력 및 스펙트럼의 구동시간에 따른 변화 상에서도, MCPCB에 부착된 SMD형 LED 램프나 기존의 COB개념에 바탕을 두고 있는 LED 램프에 비해서도 우수한 열적특성을 갖는다는 것을 확인할 수 있었다.

We fabricated a high power LED lamp structure which utilizes the modified COB concept based on an MCPCB with insulation layer partially removed. In the proposed structure, no insulation layer exists between the LED chip and the metal base. As a result, the heat generated in the chip is easily dissipated through the metal base. In actual measurement as well as in thermal simulation, the fabricated LED lamp structure showed superb thermal properties, compared to the SMD LED lamp attached on an MCPCB or the LED lamp based on conventional COB concept.

키워드

참고문헌

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