DOI QR코드

DOI QR Code

유기물 첨가제가 마이크로 패턴 구리 전주 도금에 미치는 영향 연구

Investigation on the Effect of Organic Additives on the Electroformed Cu Deposits with Micro-patterns

  • 이주열 (한국기계연구원 부설 재료연구소 융합공정연구본부) ;
  • 김만 (한국기계연구원 부설 재료연구소 융합공정연구본부) ;
  • 이규환 (한국기계연구원 부설 재료연구소 융합공정연구본부) ;
  • 임성봉 (한국기계연구원 부설 재료연구소 융합공정연구본부) ;
  • 이종일 (한국기계연구원 부설 재료연구소 융합공정연구본부)
  • Lee, Joo-Yul (Materials Processing Division, Korea Institute of Materials Science) ;
  • Kim, Man (Materials Processing Division, Korea Institute of Materials Science) ;
  • Lee, Kyu-Hwan (Materials Processing Division, Korea Institute of Materials Science) ;
  • Yim, Seong-Bong (Materials Processing Division, Korea Institute of Materials Science) ;
  • Lee, Jong-Il (Materials Processing Division, Korea Institute of Materials Science)
  • 발행 : 2010.02.28

초록

The effect of organic additives, 1-(3-sulfoproyl)-2-vinylpyridineium hydroxide (SVH) and thiourea (TU), on the precision copper electrodeposition was investigated with optical, electrochemical and x-ray diffraction techniques. It was found that SVH played a r ole as a n accelerator and TU as an i nhibitor during the electroreduction of cupric ions in acidic Cu electroplating solution. Through electrochemical measurements, TU showed more strong interaction with cupric ions than SVH and dominated overall Cu electroplating process when both additives were present in the solution. In the case of three dimensional Cu electrodeposition on the 20 ${\mu}m$-patterned Ni substrates, SVH controlled the upright growth of Cu electrodeposits and so determined its flatness, while TU prohibited the lateral spreading of Cu in the course of pulse-reverse pulse current adaptation. With microscopic observation, we obtained the optimum organic additives composition, that is, 100 ppm SVH and 200 ppm TU during the current pulsation.

키워드

참고문헌

  1. M. Yoshino, Y. Nonaka, J. Sasano, I. Matsuda, Y. Shacham-Diamand, T. Osaka, Electrochim. Acta 51 (2005) 916. https://doi.org/10.1016/j.electacta.2005.04.069
  2. M. Hasegawa, Y. Okinaka, Yosi Shacham-Diamand, T. Osaka, Electrochem. Solid-State Lett., 9 (2006) C138. https://doi.org/10.1149/1.2206008
  3. M. Hasegawa, N. Yamachika, Yosi Shacham-Diamand, Y. Okinaka, T. Osaka, Appl. Phys. Lett., 90(10) (2007) 101916. https://doi.org/10.1063/1.2712505
  4. N. Tantavichet, M. D. Pritzker, Electrochim. Acta 50 (2000) 1894.
  5. S. N. Atchison, R. P. Burford, C. P. Whitby, D. B. Hibbert, J. Electroanal. Chem., 399 (1995) 71. https://doi.org/10.1016/0022-0728(95)04188-5
  6. Q. B. Zhang, Y. X. Hua, Y. T. Wang, H. J. Lu, X. Y. Zhang, Hydrometallurgy 96 (2009) 291.
  7. H. Zhang, Z. Jiang, Y. Qiang, Mater. Sci. Eng. A 517 (2009) 316. https://doi.org/10.1016/j.msea.2009.03.079
  8. S. Varvara, L. Muresan, A. Nicoara, G. Maurin, I. C. Popescu, Mater. Chem. Phys., 72 (2001) 332. https://doi.org/10.1016/S0254-0584(01)00326-1
  9. M. Quinet, F. Lallemand, L. Ricq, J.-Y. Hihn, P. Delobelle, C. Arnould, Z. Mekhalif, Electrochim. Acta, 54 (2009) 1529. https://doi.org/10.1016/j.electacta.2008.09.052
  10. A. E. Bolzn, I. B. Wakenge, R. C. V. Piatti, R. C. Salvarezza, A. J. Arvia, J. Electroanal. Chem., 501 (2001) 241. https://doi.org/10.1016/S0022-0728(00)00535-0
  11. J.-Y. Lee, J.-W. Kim, B.-Y. Chang, H. T. Kim, S.-M. Park, J. Electrochem. Soc., 151 (2004) C333. https://doi.org/10.1149/1.1690289

피인용 문헌

  1. Effect of Thiourea on the Copper Electrodeposition vol.43, pp.6, 2010, https://doi.org/10.5695/JKISE.2010.43.6.289
  2. A study on the Additive Decomposition Generated during the Via-Filling Process vol.46, pp.4, 2013, https://doi.org/10.5695/JKISE.2013.46.4.153
  3. Fabrication of thin copper mesh for electromagnetic interference of display panel by pulse reverse current method and study on the microstructure by small angle neutron scattering vol.18, pp.5, 2012, https://doi.org/10.1007/s12540-012-5014-7