Ultrafast Laser Micro-machining Technology

극초단 펄스 레이저 응용 미세가공기술

  • 이제훈 (한국기계연구원 나노융합.생산시스템 연구본부) ;
  • 손현기 (한국기계연구원 나노융합.생산시스템 연구본부)
  • Published : 2010.02.01

Abstract

Due to the extremely short interaction time (< $10\times10^{-12}$sec) between laser pulse and material, which enables the minimization of heat affection, ultrafast laser micro-machining has rapidly widened its applications. In this paper, the characteristics of ultrafast laser micro-machining have been reviewed and experimentally demonstrated in laser drilling of silicon wafer and in laser cutting of rigid PCB.

Keywords

References

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