Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
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Effects of Nano-sized Diamond on Wettability and Interfacial Reaction for Immersion Sn Plating

  • Yu, A-Mi (School of Materials Science & Engineering, Inha University) ;
  • Kang, Nam-Hyun (Department of Materials Science & Engineering, Pusan National University) ;
  • Lee, Kang (Hwabaek Eng. Co., Ltd.) ;
  • Lee, Jong-Hyun (Department of Materials Science and Engineering, Seoul National University of Science and Technology)
  • Received : 2010.09.07
  • Accepted : 2010.09.20
  • Published : 2010.09.30
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Abstract

Immersion Sn plating was produced on Cu foil by distributing nano-sized diamonds (ND). The ND distributed on the coating surface broke the continuity of Sn-oxide layer, therefore leading to penetrate the molten solder through the oxide and retarding the wettability degradation during a reflow process. Furthermore, the ND in the Sn coating played a role of diffusion barrier for Sn atoms and decreased the growth rate of intermetallic compound ($Cu_6Sn_5$) layer during the solid-state aging. The study confirmed the importance of ND to improve the wettability and reliability of the Sn plating. Complete dispersion of the ND within the immersion Sn plating needs to be further developed for the electronic packaging applications.

Keywords

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