DOI QR코드

DOI QR Code

2.4 GHz WLAN InGaP/GaAs Power Amplifier with Temperature Compensation Technique

  • Yoon, Sang-Woong (Department of Electronics and Radio Engineering, School of Electronics and Information, Kyung Hee University) ;
  • Kim, Chang-Woo (Department of Electronics and Radio Engineering, School of Electronics and Information, Kyung Hee University)
  • Received : 2009.02.25
  • Accepted : 2009.06.15
  • Published : 2009.10.31

Abstract

This letter presents a high performance 2.4 GHz two-stage power amplifier (PA) operating in the temperature range from $-30^{\circ}C$ to $+85^{\circ}C$ for IEEE 802.11g, wireless local area network application. It is implemented in InGaP/GaAs hetero-junction bipolar transistor technology and has a bias circuit employing a temperature compensation technique for error vector magnitude (EVM) performance. The technique uses a resistor made with a base layer of HBT. The design improves EVM performance in cold temperatures by increasing current. The implemented PA has a dynamic EVM of less than 4%, a gain of over 26 dB, and a current less than 130 mA below the output power of 19 dBm across the temperature range from $-30^{\circ}C$ to $+85^{\circ}C$.

Keywords

References

  1. G. Breed, “WLAN Systems Lead Wireless Market Growth,” High Frequency Electron., vol. 1, no. 1, July 2002, pp. 34-36.
  2. P. Naraine, “Predicting the EVM Performance of WLAN Power Amplifier with OFDM Signals,” Microw. J., vol. 47, no. 5, May 2004.
  3. S.W. Yoon, “Static and Dynamic Error Vector Magnitude Behavior of 2.4GHz Power Amplifier,” IEEE Trans. Microw. Theory Tech., vol. 55, no. 4, Apr. 2007, pp. 643-647. https://doi.org/10.1109/TMTT.2007.893644
  4. M. Sagebiel et al., “An EVM-Optimized Power Amplifier for 2.4-GHz WLAN Application,” IEEE Compound Semicond. Integr. Circuits Symp., 2005, pp. 162-165.
  5. W. Liu et al., “The Use of Base Ballasting to Prevent the Collapse of Current Gain in AlGaAs/GaAs Heterojunction Bipolar Transistors,” IEEE Trans. Electron. Devices, vol. 43, no. 2, Feb. 1996, pp. 245-251. https://doi.org/10.1109/16.481724
  6. J. Nam, J. Shin, and B. Kim, “Load Modulation Power Amplifier with Lumped-Element Combiner for IEEE 802.11b/g WLAN Applications,” IET Electron. Lett., vol. 42, no. 1, Jan. 5, 2006, pp. 24-25. https://doi.org/10.1049/el:20063591

Cited by

  1. 2.4-GHz Power Amplifier with Power Detector Using Metamaterial-Based Transformer-Type On-Chip Directional Coupler vol.35, pp.3, 2009, https://doi.org/10.4218/etrij.13.0212.0350
  2. Efficient Wi-Fi Power Amplifier LTCC Module Using a Buck Converter With a Power Inductor Implemented in Ferrite-Filled PCB Technology vol.5, pp.7, 2009, https://doi.org/10.1109/tcpmt.2015.2443020