대한금속재료학회지 (Korean Journal of Metals and Materials)

  • 제47권11호
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  • Pages.740-747
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  • 2009
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  • 1738-8228(pISSN)
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  • 2288-8241(eISSN)
대한금속재료학회 (The Korean Institute of Metals and Materials)
권호 표지

구리전착층의 물성에 미치는 전해액 조성의 영향

The Effects of Electrolyte Compositions on the Property of Copper Electrodeposited Layer

  • 박은광 (전북대학교 공과대학 신소재공학부) ;
  • 이만형 (전북대학교 공과대학 신소재공학부) ;
  • 우태규 (전북대학교 공과대학 신소재공학부) ;
  • 박일송 (전북대학교 공과대학 신소재공학부) ;
  • 정광희 (전북대학교 공과대학 신소재공학부) ;
  • 설경원 (전북대학교 공과대학 신소재공학부)
  • Park, Eun-Kwang (Division of Advanced Materials Engineering, College of Engineering, Chonbuk National University) ;
  • Lee, Man-Hyung (Division of Advanced Materials Engineering, College of Engineering, Chonbuk National University) ;
  • Woo, Tae-Gyu (Division of Advanced Materials Engineering, College of Engineering, Chonbuk National University) ;
  • Park, Il-Song (Division of Advanced Materials Engineering, College of Engineering, Chonbuk National University) ;
  • Jung, Kwang-Hee (Division of Advanced Materials Engineering, College of Engineering, Chonbuk National University) ;
  • Seol, Kyeong-Won (Division of Advanced Materials Engineering, College of Engineering, Chonbuk National University)
  • 투고 : 2009.03.06
  • 발행 : 2009.11.25
⟨ 이전 논문 다음 논문 ⟩

초록

The purpose of this study is to identify the effect of electrolyte compositions on electrodeposited copper foil. First of all, the polyimide substrate was pretreated with plasma. Finally, copper foil was deposited on a Cu/Ni/Polyimide substrate using the electroplating technique. As the quantity of Cu increased, preferred orientations changed into (111). Increasing sulfuric acid, on the other hand, brought down the preferred orientation of (111). The lowest sheet resistance, surface roughness, and fine adhesion were detected when the ratio of $Cu^{2+}$ and $H_2SO_4$ is 50:50(g/l).

키워드

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