Transactions of Materials Processing (소성∙가공)

The Korean Society for Technology of Plasticity and materials processing (한국소성∙가공학회)
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Mechanical and Electrical Properties of Submicrocrystalline Cu-3%Ag Alloy

초미세 결정립 Cu-3%Ag 합금의 기계적/전기적 특성

  • 고영건 (영남대학교 신소재공학부) ;
  • 이철원 (한양대학교 금속재료공학과) ;
  • 남궁승 (한양대학교 금속재료공학과) ;
  • 이동헌 (한양대학교 금속재료공학과) ;
  • 신동혁 (한양대학교 금속재료공학과)
  • Published : 2009.10.01
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Abstract

The present work demonstrates the mechanical and electrical responses of submicrocrystalline Cu-3%Ag alloy as a function of strain imposed by equal channel angular pressing(ECAP). From transmission electron microscope observation, the resulting microstructures of Cu-3%Ag alloy deformed by ECAP for 8-pass or more consist of reasonably fine, equiaxed grains without having a strong preferred orientation, suggesting that microstructure evolution is slower than that of pure-Al and its alloys owing to low stacking fault energy. The results of room temperature tension tests reveal that, as the amount of applied strain increases, the tensile strength of submicrocrystalline Cu-3%Ag alloy increases whereas losing both the ductility and the electrical conductivity. Such phenomenon can be explained based on microstructure featured by the non-equilibrium grain boundaries.

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References

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