채소 자동결속기의 개발(II) : 시제품제작 및 성능검증

Development of Automatic Bundle Machine for Vegetables(II) : Prototype Manufacture and Performance Test

  • 김용석 (울산대학교 기계자동차공학부) ;
  • 박성호 (경일대학교 기계자동차학부) ;
  • 양순용 (울산대학교 기계자동차공학부)
  • 발행 : 2009.08.15

초록

In this paper, it has been proposed an automatic vegetable bundling mechanism that makes use of heat melt sticking. The proposed mechanism is consisted of three modules for the rationality of manufacture. Design specification has been determined by the bundling mechanism that was optimized mechanically. And, it has been manufactured the prototype of the automatic bundling machine. It has been carried out directly the field test for verification of performance in farmhouse which produces vegetable. In field test, this bundling machine showed efficiency of about 3.6 times than the manual working by manpower, and other performance it got satisfied result. This automatic vegetable-bundling machine was already registered as the agricultural machine. and This machine will be commercialized soon.

키워드

참고문헌

  1. Kim, Y. S., Park, T. P., Kim, J. J., Park, S. H., and Yang, S. Y, 2008, "Development of Automatic Bundle Machine for Vegetables(I): Mechanism Design," Trans. of the Korean Society of Machine Tool Engineers, accepted for publication.
  2. Kim, Y. S., Kim, J. J., Lee, C. D., and Yang, S. Y., 2008, "A Study on Design of Bundling Mechanism for Vegetables," Proceeding of the Ksmte Spring Conference 2008, pp. 159-163.
  3. COMFILE Technology, nd., viewed 10 December 2007,
  4. NIAE, 2007.3, Experiment method of binding Machine for agricultural products, NAMRI T 6050, National Institute of Agriculture Engineering, Korea.
  5. NIAE, 2004.12, Checkup standards of binding Machine for agricultural products, NAMRI S 6050, National Institute of Agriculture Engineering, Korea.
  6. Park, T. P., Kim, Y. S., and Yang, S. Y, 2007, Automatic Bundle Packing Apparatus using bonding Tape, Korea Patent: Patent No.10-0726096.
  7. Park, T. P., Kim, Y S., and Yang, S. Y, 2007, Automatic Bundle Packing Apparatus using bonding Tape, Patent Cooperation Treaty : Application No. PCT/KR2007/003443.