The Transactions of The Korean Institute of Electrical Engineers (전기학회논문지)

The Korean Institute of Electrical Engineers (대한전기학회)
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Degradation Behavior and Resistivity Changes After Thermal Aging of Matte Tin-Plated Copper Sheet for Current Collector in Fuel Cell

시효처리된 연료전지 집전판용 Matte 주석도금 동판의 고온열화 거동과 비저항변화

  • 김주한 (충남대 전기공학과) ;
  • 김재훈 (충남대 전기공학과) ;
  • 구경완 (호서대 국방과학기술학과) ;
  • 금영범 (현대-기아자동차 환경기술연구소 연료전지개발1팀) ;
  • 정귀성 (현대-기아자동차 환경기술연구소 연료전지개발1팀) ;
  • 고행진 (현대-기아자동차 환경기술연구소 연료전지개발1팀) ;
  • 한상옥 (충남대 전기공학과)
  • Published : 2009.08.01
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Abstract

Resistivity changes and intermetallic growth after thermal aging of Matter tin-plated copper sheet for current collector in fuel cell were investigated to survey the diffusion of Cu into Sn in interface and surface. The results show that the intermetallic growth and resistivity depended on thermal aging temperature and dwell time. In Sn plate on a Cu substrate, Cu6Sn5(${\mu}$) and Cu3Sn(${\varepsilon}$) intermetallics layer were formed at plate/substrate interface. Cu6Sn5(${\mu}$) intermetallics layer gradually changed Cu3Sn(${\varepsilon}$). Moreover Cu get through Sn layer and it was diffused in the surface at $200^{\circ}C$. On the other hand, only Cu3Sn(${\varepsilon}$) intermetallics layer were formed at plate/substrate interface at $300^{\circ}C$. Consequently, the intermetallics formation, thermal condition and oxidation of surface, causes increase in the resistivity of Tin-plated copper sheet.

Keywords

References

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