슈퍼크리티컬 나노 플레이팅에 의한 표면개질

The Surface Improvement by Supercritical Nano Plating

In this study, supercritical nano plating was performed to observe its effect on materials. Using supercritical carbon dioxide as a solvent, we observed how different pressures and temperatures of the supercritical fluid affected the process and its outcome. The plating current increases as pressure increases from 8 MPa to 16 MPa, but it decreases after that. Similarly, the plating current increases as temperature is increased from $35^{\circ}C$ to $45^{\circ}C$, but the current decreases after that. Also, the thickness of the wet electrolyte plating is about $35\sim50{\mu}m$, while the thickness of the plating done using supercritical fluid is about $20\sim25{\mu}m$. At the results, It to it is considered that supercritical nano plating enable to form more thin and stable plating than wet electroplating methods. Also both of the electroplating methods could be affected plating quality by surface condition, and the supercritical nano plating has been confirmed to product more uniform plating surface than wet electroplating.