Korean Journal of Optics and Photonics (한국광학회지)

Optical Society of Korea (한국광학회)
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Implementation of LED Module Using MCPCB with Hard Barrier Anodizing Oxide Layer

경장벽 산화막 절연층 MCPCB를 이용한 LED 모듈 구현

  • Hong, Dae-Woon (Electronics Engineering Department, Chungnam National University) ;
  • Lee, Sung-Jae (Electronics Engineering Department, Chungnam National University) ;
  • Cho, Jae-hyun (Department of Materials Science and Engineering, Kyonggi Universiy)
  • 홍대운 (충남대학교 전자공학과 광파전자공학연구실) ;
  • 이성재 (충남대학교 전자공학과 광파전자공학연구실) ;
  • 조재현 (경기대학교 재료공학과 박막연구실)
  • Published : 2009.08.25
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Abstract

LED modules, based on MCPCB with a hard barrier oxide layer and an improved thermal dissipation property, are presented. Reflecting cups were also formed on the surface of the MCPCB such that optical coupling between neighboring chips was minimized for improving the photon absorption loss. LED chips were directly attached on the MCPCB by using the COB (Chip On Board) scheme. The LED modules showed significantly enhanced light outputs, compared to the LED modules based on conventional MCPCBs.

LED 조명과 액정 후면 배광 장치와 같이 고방열, 고출력 광원이 요구되는 응용제품에 적합한 LED 광원 모듈을 제작하였다. 제안한 LED 광원 모듈은 기존 패키지 구조의 LED 광원과 다르게 LED 칩을 응용제품의 필요에 따른 배광 분포 제어와 광자재흡수를 개선하기 위해 반사컵 구조를 적용한 금속 기판의 표면에 LED 칩을 바로 실장하였다. 또한 기존 금속기판에 적용하던 알루미늄 산화막 절연층의 문제점을 개선하여 방열 특성을 향상시켰다. 나아가 방열 특성 개선으로 LED 칩에서 발생하던 열에 의해 발생하던 광효율 저하 문제를 개선하는 결과를 얻었다.

Keywords

References

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Cited by

  1. Heat dissipation of Al2O3 Insulation layer Prepared by Anodizing Process for Metal PCB vol.48, pp.2, 2015, https://doi.org/10.5695/JKISE.2015.48.2.33