Heat Resistant Electromagnetic Noise Absorber Films Using Poly(amide imide)/Soft Magnet Composite

내열성 전자기 노이즈 흡수 폴리(아미드-이미드)/연자성체 복합체 필름

  • Han, Ji-Eun (Department of Chemical Engineering, Sungkyunkwan University) ;
  • Jeon, Byung-Kuk (Department of Chemical Engineering, Sungkyunkwan University) ;
  • Goo, Bon-Jae (Department of Chemical Engineering, Sungkyunkwan University) ;
  • Cho, Seung-Hyun (Polymer Technology Institute, Sungkyunkwan University) ;
  • Kim, Sung-Hoon (R&D Center, Chang Sung Corporation) ;
  • Lee, Kyung-Sub (R&D Center, Chang Sung Corporation) ;
  • Park, Yun-Heum (Department of Chemical Engineering, Sungkyunkwan University) ;
  • Lee, Jun-Young (Department of Chemical Engineering, Sungkyunkwan University)
  • Published : 2009.01.25

Abstract

We fabricated the electromagnetic (EM) noise absorber films for high temperature use by blending a soft magnetic powder with poly(amide imide) (PAI). The EM noise absorber films of PAI/soft magnet composite were prepared by casting the solution of poly(amide amic acid)/soft magnet powder into glass substrate with casting applicator device and then thermal imidization. The obtained films were fully characterized and their physical properties including thermal behavior, thermal stability and mechanical properties were studied. The EM noise absorption ability was also investigated using micro-strip line method. At 1 GHz, the power loss of composite film with 150 ${\mu}m$ thickness was about 25%.

폴리(아미드-이미드)와 연자성체의 블렌딩에 의해 고온에서 이용 가능한 내열성 전자기 노이즈 흡수용 필름을 제조하였다. N,N-디메틸아세트아미드에 폴리(아미드 아믹 산)을 용해시킨 후 연자성체 파우더를 혼합하고 이용액을 유리 기판에 캐스팅한 뒤 열을 가하여 이미드화하는 방법으로 전자기 노이즈 흡수 필름을 제조하였다. 제조된 필름의 열적 특성, 열 안정성 및 기계적 성질을 분석하고 마이크로 스트립 라인 법에 의해 전자기 흡수력을 측정하였는데,1 GHz에서 150 ${\mu}m$두께의 복합체 필름의 전력손실(power loss)은 약 25%였다.

Keywords

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