접착 및 계면 (Journal of Adhesion and Interface)

  • 제10권3호
  • /
  • Pages.134-140
  • /
  • 2009
  • /
  • 1229-9243(pISSN)
  • /
  • 2233-8217(eISSN)
한국접착및계면학회 (The Society of Adhesion and Interface, Korea)
권호 표지

아크릴계 점착제와 초박형 웨이퍼소재와의 점착특성 - 아크릴 중합체의 측쇄의 영향 -

Adhesion Characteristics of Acrylic Pressure Sensitive Adhesives on Thin Wafer Materials - Effect of Acrylic Copolymer Side Chain -

  • 유종민 (충남대학교 공업화학과 유기재료응용화학 연구실) ;
  • 남영희 (충남대학교 공업화학과 유기재료응용화학 연구실) ;
  • 이승현 (충남대학교 공업화학과 유기재료응용화학 연구실) ;
  • 김형일 (충남대학교 공업화학과 유기재료응용화학 연구실) ;
  • 임동혁 (서울대학교 환경재료과학전공 바이오복합재료 및 접착과학 연구실, 농업생명과학연구원) ;
  • 김현중 (서울대학교 환경재료과학전공 바이오복합재료 및 접착과학 연구실, 농업생명과학연구원) ;
  • 김경만 (화학연구원 에너지소재연구센터)
  • Ryu, Chong-Min (Lab.of Applied Chemistry of Organic Materials, Department of Industrial Chemistry, Chungnam National University) ;
  • Nam, Young-Hee (Lab.of Applied Chemistry of Organic Materials, Department of Industrial Chemistry, Chungnam National University) ;
  • Lee, Seung-Hyun (Lab.of Applied Chemistry of Organic Materials, Department of Industrial Chemistry, Chungnam National University) ;
  • Kim, Hyung-Il (Lab.of Applied Chemistry of Organic Materials, Department of Industrial Chemistry, Chungnam National University) ;
  • Lim, Dong-Hyuk (Lab. of Adhesion & Bio-Composites, Program in Environmental Materials, Research Institute and for Agriculture and Life Sciences, Seoul National University) ;
  • Kim, Hyun-Joong (Lab. of Adhesion & Bio-Composites, Program in Environmental Materials, Research Institute and for Agriculture and Life Sciences, Seoul National University) ;
  • Kim, Kyung Man (Center of Energy Materials, Korea Research Institute of Chemical Technology)
  • 투고 : 2009.09.07
  • 심사 : 2009.09.14
  • 발행 : 2009.09.30
PDF 다운로드
⟨ 이전 논문 다음 논문 ⟩

초록

분자설계를 통하여 측쇄를 변화시킨 아크릴공중합체를 합성하여 아크릴공중합체 점착제와 초박형웨이퍼와의 젖음성 및 점착물성을 조사하였다. 선형 아크릴공중합체를 에폭시계 Tetra-DX 가교제와 반응시켜 3차원 망상구조를 형성하고 가교의 영향을 조사하였다. 계면상호작용보다는 아크릴공중합체의 측쇄변화가 젖음성에 더 큰 영향을 미쳤다. 가교도가 증가할수록 probe tack, peel strength가 감소하는 경향을 나타냈다. 가교에 의해 SAFT 내열성이 증가하였지만 가교제의 함량이 증가하면 오히려 SAFT 내열성이 감소하였다.

The acrylic copolymers with variation in side chain were synthesized based on molecular design. Wettability and adhesion properties on the wafer surface were investigated for these acrylic copolymer pressure sensitive adhesives. Three-dimensional networks of linear acrylic copolymers were produced with epoxy-type Tetra-DX cross-linking agent. The effect of cross-linking on adhesion characteristics was investigated. The side chain of acrylic copolymer played more important role in wettability than the interfacial interaction. As the degree of cross-linking increased, both probe tack and peel strength decreased. Also, heat resistance measured by SAFT increased with cross-linking; however, it showed the deterioration when excess cross-linking agent was added.

키워드

참고문헌

  1. H. S. Joo, D. H. Lim, Y. J. Park, and H. J. Kim, Journal of Adhesion and Interface, 6, 19 (2005).
  2. C. T. Murray, R. L. Rudman, M. B. Sabade, and A. V. Poicus, MRS Bull., 449 (2003).
  3. J. A. Pomposo, J. Rodriguez, and H. Grande, Synthesis Metals, 104, 107 (1999). https://doi.org/10.1016/S0379-6779(99)00061-2
  4. K. Ebe, H. Seno, and K. Horigome, J. Appl. Polym. Sci., 90, 436 (2003). https://doi.org/10.1002/app.12673
  5. K. Horigome, K. Ebe, and S. Kuroda, J. Appl. Polym. Sci., 93, 2889 (2004). https://doi.org/10.1002/app.20884
  6. T. Ozawa, S. Ishiwata, and Y. Kano, Furukawa Review, 20, 83 (2001).
  7. I. Benedek and L. J. Heymans, "Pressure Sensitive Adhesives Technology", Marcel Decker, USA (1997).
  8. D. Satas, "Handbook of Pressure Sensitive Adhesive Technology and Applications" edited by D. Satas, Satas & Associates, USA (2002).
  9. 차세대 패키지용 SOP 기술개발에 관한 산업분석, 전자부품연구원 (2005).
  10. High-Density Packaging (MCM, MCP, SIP): Market Analysis and Technology Trends, The Information Network (2005).
  11. I. Kim and M. Lee, Korean Chem. Eng. Res., 46, 76 (2008).
  12. 박종진, 김재환, 대한민국특허 10-2000-0035727.
  13. 세누히데오, 콘도다께시, 대한민국 특허 10-1999-0032549.
  14. 도현성, 김현중, 대한민국 특허출원 10-2004-094902.
  15. J. A. Pomposo, J. Rodriguez, and H. Grande, Synthesis Metals, 104, 107 (1999). https://doi.org/10.1016/S0379-6779(99)00061-2
  16. H. Choi, S. Park, Y. Lee, I. Hwang, J. Kim, and H. Cho, US patent, 0186421 (2005).
  17. L. Ma, X. Wang, B. Wang, J. Chen, J. Wang, K. Huang, B. Zhang, Y. Cao, Z. Han, S. Qian, and S. Yao, Chem. Phys., 285, 85 (2002). https://doi.org/10.1016/S0301-0104(02)00691-2
  18. S. Pargfrieder, P. Lindner, G. Mittendorfer, and J. Weixlberger, "Ultrathin wafer processing Temporary Bonding", Semiconductor International (2006).
  19. C. M. Chan, "Polymer Surface Modification and Characterization", Hanser, Munchen, Germany (1993).
  20. F. M. Fowkes, J. Adhes. Sci. Technol., 1, 7 (1987). https://doi.org/10.1163/156856187X00049
  21. J. M. Park, D. S. Kim, and S. R. Kim, Compos. Sci. Technol., 64, 847 (2004). https://doi.org/10.1016/j.compscitech.2003.09.009
  22. A. E. O'Connor and N. Willenbacher, International Journal of Adhesion & Adhesives, 24, 335 (2004). https://doi.org/10.1016/j.ijadhadh.2003.11.005
  23. N. J. Glassmaker, C. Y. Hui, T. Yamaguchi, and C. Creton, The European Physical Journal E., 25, 253 (2008). https://doi.org/10.1140/epje/i2007-10287-y