신재생에너지 (New & Renewable Energy)
- 제5권1호
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- Pages.26-31
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- 2009
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- 1738-3935(pISSN)
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- 2713-9999(eISSN)
염기용액을 이용한 태양전지용 실리콘 기판의 절삭손상층 식각 특성
The Saw Damage Etching Characteristics of Silicon Wafer for Solar Cell with Alkaline Solutions
초록
The surface etching characteristics of single crystalline silicon wafer were investigated using potassium hydroxide (KOH) and tetramethylammonium hydroxide (TMAH). The saw damage layer was removed after 10min by KOH 45wt% solution at
키워드