한국전기전자재료학회논문지 (Journal of the Korean Institute of Electrical and Electronic Material Engineers)

  • 제22권2호
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  • Pages.123-127
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  • 2009
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  • 1226-7945(pISSN)
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  • 2288-3258(eISSN)
한국전기전자재료학회 (The Korean Institute of Electrical and Electronic Material Engineers)
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전류모드에 따른 전해도금된 마이크로 비아의 전기적 특성 연구

Study on the Electric Characteristics of Electroplated Micro Vias with Current Mode

  • 발행 : 2009.02.01
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초록

In order to get more higher integration density of devices, it is getting to be used more and more micro via interconnection lines for interconnecting layers or devices. However, it is very important to enhance the electrical characteristic by reducing the electrical resistivity of micro via interconnection line because it affects the reliability of packaging. In this paper, Micro vias were patterned with a diameter from 10 to 100 um by increasing the step of 10 um and 100 um height and were fabricated by micromachining technology to investigate the electrical characteristic of micro via interconnection lines. These micro vias were filled with copper by electroplating process with appling pulse current mode. And the electrical characteristics of micro via interconnection lines were measured. The measured value of electrical resistivity shows with a range from 20 to $26\;m{\Omega}$. This value from micro via interconnection lines fabricated by pulse current mode electroplating process shows better result than the resistivity from than micro via interconnection lines fabricated by DC mode ($31\;m{\Omega}$).

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참고문헌

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