References
- Abicht, H., Voltzke, D., and Schmidt, H., Chem. Phys. Vol. 51, (1997). 35-41 https://doi.org/10.1016/S0254-0584(97)80263-5
- R. Xu, M. Shen, S. Ge, Z. Gan, and W. Cao, Thin Solid Films, Vol. 406, (2002). 113-117 https://doi.org/10.1016/S0040-6090(02)00050-0
- Ya. I. Alivov, F. Agara, B. Xiao, S. Chevtchenko, H. Morkoc and J. G. Yoon, J. Korean Phys. Soc., Vol. 53, (2008). 1982-1986 https://doi.org/10.3938/jkps.53.1982
- J. G. Yoon, K. O. Jung, H. J. Kim, and K. S. Kim, J. Korean Phys. Soc. Vol. 53, (2008). 2033-2036 https://doi.org/10.3938/jkps.53.2033
- Ping-Hua Xiang, Hiroaki Takeda, and Tadashi Shiosaki, Appl. Phys. Lett. Vol. 91, (2008). 162-164 https://doi.org/10.1063/1.2799878
- Kyoung-Tae Kim, Chang-ll Kim, and Sung-Gap Lee, Microelectronic Engineering, Vol. 66, (2003). 662-669 https://doi.org/10.1016/S0167-9317(02)00980-2
- H. Takeda, W. Aoto, and T. Shiosaki, Appl. Phys. Lett. Vol. 87, (2005). 102-104 https://doi.org/10.1063/1.2042551
- X. X. Wang, H. L. W. Chan, and C. L. Choy, Solid State Commun. Vol. 125, (2003). 395-399 https://doi.org/10.1016/S0038-1098(02)00816-5
- H. Nagata, M. Yoshida, Y. Makiuchi, and T. Takenaka, Jpn. J. Appl. Phys., Vol. 42, (2003) 7401-7403 https://doi.org/10.1143/JJAP.42.7401
- C. Peng, J. F. Li, and W. Gong, Mater. Lett., Vol. 59, (2005). 1576-1580 https://doi.org/10.1016/j.matlet.2005.01.026
- B. J. Chu, D. R. Chen, G. R. Li, and Q. R. Yin, J. Eur. Ceram. Soc. Vol. 22, (2005). 2115-2121 https://doi.org/10.1016/S0955-2219(02)00027-4
- Lee Sung-Gap, Shim Young-Jae, Kim Cheol-Jin, and Chung Jun-Ki, J. Alloys and Compounds, Vol. 449, (2008). 73-76 https://doi.org/10.1016/j.jallcom.2006.01.115
- M. J. Han, and J. J Yu, J. Korean Phys. Soc. Vol. 53, (2008). 1734 https://doi.org/10.3938/jkps.53.1074
- S. G. Lee, and Y. H. Lee, Thin Solid Films, Vol. 353, (1999). 244 https://doi.org/10.1016/S0040-6090(99)00408-3
- Guifen Fan, Wenzhong Lu, Xiaohong Wang, and Fei Liang, Appl. Phys. Lett., Vol. 91, (2007). 202, 908 https://doi.org/10.1063/1.2815918