마이크로전자및패키징학회지 (Journal of the Microelectronics and Packaging Society)
- 제15권2호
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- Pages.17-21
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- 2008
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- 1226-9360(pISSN)
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- 2287-7525(eISSN)
무전해 도금법을 이용한 Sn-Cu 범프 형성에 관한 연구
Fabrication of Sn-Cu Bump using Electroless Plating Method
- Moon, Yun-Sung (Department of Materials Science and Engineering, Hongik University) ;
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Lee, Jae-Ho
(Department of Materials Science and Engineering, Hongik University)
- 발행 : 2008.06.30
초록
Sn-Cu계 솔더 범프에서 무전해도금법을 이용한 범프 형성에 대한 연구를 하였다.
The electroless plating of copper and tin were investigated for the fabrication of Sn-Cu bump. Copper and tin were electroless plated in series on