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마이크로 압입 크리프 시험기 개발 및 성능평가

Development and its Performance Evaluation of a Micro-Impression Creep Machine

  • 양경탁 (서울산업대학교 자동차공학과 산업대학원) ;
  • 김현준 (서울산업대학교 나노아이티 대학원) ;
  • 김호경 (서울산업대학교 자동차공학과)
  • Yang, Kyoung-Tak (Graduate School of Industry and Engineering, Seoul National University of Technology) ;
  • Kim, Hyun-Jun (Graduate School of NIT, Seoul National University of Technology) ;
  • Kim, Ho-Kyung (Department of Automotive Engineering, Seoul National University of Technology)
  • 발행 : 2008.02.29

초록

A micro-impression creep machine was designed and developed, adopting a small punch in diameter of 150 um, displacement gage with an accuracy of sub-${\mu}m$ scale, and load-cell with an accuracy of mN scale in order to investigate creep behavior of small solder ball in diameter of less than 1 mm. Creep behavior of lead-free solder ball(Sn-3.0Ag-0.5Cu) in diameter of $760\;{\mu}m$ was investigated in the stress range of $8{\sim}60\;MPa$ and at $303\;K{\sim}393\;K$. The applied load became decreased slightly and continuously in the creep rate of $10^{-4}/s$ range during the current experiments. Also, the machine frame was so sensitive to the environmental temperature that nm scaled displacement recording was unstable according to the change in environmental temperature.

키워드

참고문헌

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