참고문헌
- J.W. Yoon, W.C. Moon and S.B. Jung: Core technology of electronic packaging, Journal of KWS, 23-2 (2005), 116-123 (in Korean)
- J.W. Yoon, J.W. Kim, J.M. Koo, S.S. Ha, B.I. Noh, W.C. Moon. J.H. Moon and S.B. Jung: Flip-chip technology and reliability of electronic packaging, Journal of KWS, 25-2 (2007), 108-117 (in Korean) https://doi.org/10.5781/KWJS.2007.25.2.006
- M. Hutter, F. Hohnke, H. Oppermann, M. Klein and G. Engelmann : Assembly and reliability of flip chip solder joints using miniaturized Au/Sn bumps, 2004 Electronic Components and Technology Conference, (2004), 49-57
- D.Q. Yu, H. Oppermann, J. Kleff and M. Hutter : Interfacial metallurgical reaction between small flip-chip Sn/Au bumps and thin Au/TiW metallization under multiple reflow, Scripta Materialia, 58 (2008), 606-609 https://doi.org/10.1016/j.scriptamat.2007.11.020
- Y. H. Wang, K. Nishida, M. Hutter, T. Kimura and T. Suga : Low-temperature process of fine-pitch Au-Sn bump bonding in ambient air, Japanese Journal of Applied Physics, 46 (2007), 1961-1967 https://doi.org/10.1143/JJAP.46.1961
- J.W. Yoon: Ph.D degree thesis, Sungkyunkwan University, (2006)
- J.W. Yoon, H.S. Chun and S.B. Jung : Reliability analysis of Au-Sn flip-chip solder bump fabricated by co-electroplating, Journal of Materials Research, 22(5) (2007), 1219-1229 https://doi.org/10.1557/jmr.2007.0145
- J.W. Yoon, H.S. Chun, Ja-Myeong Koo, Hoo-Jeong Lee and S.B. Jung : Microstructural evolution of Sn-rich Au-Sn/Ni flip-chip solder joints under high temperature storage testing conditions, Scripta Materialia, 56 (2007), 661-664 https://doi.org/10.1016/j.scriptamat.2006.12.031
- J.W. Yoon, H.S. Chun and S.B. Jung : Reliability evaluation of Au-20Sn flip-chip solder bump fabricated by sequential electroplating method with Sn and Au, Materials Science and Engineering A, 473 (2008), 119-125 https://doi.org/10.1016/j.msea.2007.03.050
- S. Anhock, H. Oppermann, C. Kallmayer, R. Aschenbrenner, L. Thomas and H. Reichl: Investigations of Au-Sn alloys on different endmetallizations for high temperature applications. In Proceeding of the 1998 IEEE/CPMT Berlin International Electronics Manufacturing Technology Symposium, IEEE, Piscataway, NJ, (1998), 156-165
- S.S. Kim, J. H. Kim, S.W. Booh, T.G. Kim and H.M. Lee: Microstructural evolution of joint interface between eutectic 80Au-20Sn solder and UBM, Mater. Trans. 46 (2005), 2400-2405 https://doi.org/10.2320/matertrans.46.2400