Journal of Welding and Joining

The Korean Welding and Joining Society (대한용접접합학회)
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Solder Bumping for Flip Chip Bonding

플립 칩 본딩을 위한 솔더 범핑

  • 정재필 (서울시립대학교 신소재공학과) ;
  • 이희열 (서울시립대학교 신소재공학과) ;
  • 전지헌 (서울시립대학교 신소재공학과)
  • Published : 2008.02.28
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Abstract

Keywords

References

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  2. S. Alsarawi, D. Abbott, P. Franzon, 'A Review of 3-D Packaging Technology', IEEE Transactions on Components Packaging and Manufacturing Technology, part B, 21-1, (1998)
  3. 정재필, 전주선, '초음파를 이용한 고품질 무연솔더 분말 및 무연 크림솔더 개발', 산업자원부 연구보고서(2003)
  4. www.flipchips.com/tutorial
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  6. R. Kay, E. Gourcuff, M. Desmulliez, L. Crescent, Stencil Printing Technology for Wafer Level Bumping at Sub-100 Micron Pitch using Pb-Free Alloys', 2005 Electronic Components and Technology Conference_
  7. 박재현,정재필,정승부, 솔더볼 신뢰성 표준화 연구, 2008, 기술표준원
  8. K. Shimokawa, E. Hashino, Y. Ohzelu, K. Tatsumi, 'Micro-ball Bump for Flip Chip Interconnections', IEEE 1998 Electronic Components and Technology Conference
  9. Hong, S. M., Kang, C.S., Jung, J. P, Plasma Reflow Bumping of Sn-3.5 Ag Solder for Flux-Free Flip Chip Package Application. IEEE Transactions on Advanced Packaging, 27-1, (2004), 90-96 https://doi.org/10.1109/TADVP.2003.821079
  10. SW Jung, JP Jung, Y Zhou, Characteristics of Sn-Cu Solder Bump Formed by Electroplating for Flip Chip ; IEEE Transactions on Electronics Packaging Manufacturing, 29-1,10-16
  11. 정재필, 초음파를 이용한 환경친화적 Solderless 초소형 flip chip 범프제조, 2006-2008, 아이셀론-산자부
  12. 畑田 賢造, 범프기술의 개요, 實裝技術 2001, No. 12

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