참고문헌
- M. Datta, T. Osaka, J.W. Schultze : Microelectronic Packaging, CRC Press, 2005, 1-28, 167-200
- J.H. Lau : Low Cost Flip Chip Technologies, McGraw-Hill, 2001, 1-17, 27-90
- J.W. Kim, D.G. Kim, W.S. Hong, S.B. Jung : Evaluation of Solder Joint Reliability in Flip Chip Packages during Accelerated Testing, Journal of Electronic Materials, 34, (2005), 1550-1557 https://doi.org/10.1007/s11664-005-0164-8
- J.W. Kim, Y.C. Lee, D.G. Kim, S.B. Jung : Reliability of adhesive interconnections for application in display module, Microelectronic Engineering, 84, (2007), 2691-2696 https://doi.org/10.1016/j.mee.2007.05.066
- Y.C. Chan, S.C. Tan, Nelson S.M. Lui, C.W. Tan : Electrical characterization of NCP- and NCF-bonded fine-pitch flip-chip-on-flexible packages, IEEE Transactions on Advanced Packaging, 30, (2007), 142-147 https://doi.org/10.1109/TADVP.2006.890215
- J.W. Kim, D.G. Kim, Y.C. Lee, S.B. Jung : Analysis of failure mechanism in anisotropic conductive and non-conductive film interconnections, IEEE Transactions on Components and Packaging Technologies, in press
- David M. Pozar : Microwave Engineering, Wiley, 2005, 161-221
- M.J. Yim, I.H. Jeong, H.K. Choi, J.S. Hwang, J.Y. Ahn, W. Kwon, K.W. Paik : Flip chip interconnection with anisotropic conductive adhesives for RF and high-frequency applications, IEEE Transactions on Components and Packaging Technologies, 28, (2005), 789-796 https://doi.org/10.1109/TCAPT.2005.859750
- J.W. Kim, Y.C. Lee, S.S. Ha, J.M. Koo, J.H. Ko, W. Nah, S.B. Jung : Electrical characterization of adhesive flip chip interconnects for microwave application, Journal of Micro/Nanolithography, MEMS, and MOEMS, in-press
- J.W. Kim, Y.C. Lee, S.B. Jung : Reliability of conductive adhesives as a Pb-free alternative in flip-chip applications, Journal of Electronic Materials, 37, (2008), 9-16 https://doi.org/10.1007/s11664-007-0252-z
- J.W. Kim, D.G. Kim, J.M. Koo, J.W. Yoon, S. Choi, K.S. Kim, J.D. Nam, H.J. Lee, J. Joo, S.B. Jung : Characterization of failure behaviors in anisotropic conductive interconnection, Materials Transactions, 48, (2007), 1070-1078 https://doi.org/10.2320/matertrans.48.1070
- J.W. Kim, Y.C. Lee, J.H. Ko, W. Nah, M.Y. Jeong, H.C. Kwon, S.B. Jung : Microwave performance of flip chip interconnects with anisotropic and non-conductive films, Journal of Adhesion Science and Technology, in-press