Korean Journal of Air-Conditioning and Refrigeration Engineering (설비공학논문집)

The Society of Air-Conditioning and Refrigerating Engineers of Korea (대한설비공학회)
권호 표지

Performance Test of Liquid Cooling Type Cold Plates for Robot Cooling

로봇 냉각을 위한 수냉식 냉각판의 성능 평가

  • Lee, Suk-Won (Graduated School of Mechanical Information Engineering, University of Seoul) ;
  • Karng, Sarng-Woo (Energy Mechanics Research Center, Korea Institute of Science and Technology) ;
  • Hwang, Kyu-Dae (Department of Industrial Japanese, Yuhan College) ;
  • Kim, Seo-Young (Energy Mechanics Research Center, Korea Institute of Science and Technology) ;
  • Rhee, Gwang-Hoon (Department of Mechanical and Information Engineering, University of Seoul)
  • Published : 2008.03.10
Download PDF
⟨ Previous Next ⟩

Abstract

The increase of system weight due to installation of cooling devices adds electrical and mechanical loads of humanoid robot, and in return, results in much heat. Therefore, the weight of cooling system is a critical issue for robot cooling. In this study, we propose non-metallic cold plates to deal with such problems. We compare thermal performances between one metallic cold plate and five different types of non-metallic cold plates. A metallic cold plate is totally made of copper. Five non-metallic PC(polycarbonate) cold plates, which are designed to reduce the overall weight of robot cooling system, are composed of a polycarbonate cover with different types of base plate. The overall heat transfer coefficients per unit mass and thermal resistances are obtained for the cold plates. The metallic cold plate shows the best thermal performance. It is interesting to note that the PC cold plate with an aluminum base plate with 18 channels shows the best overall heat transfer coefficient per unit mass. Most polycarbonate cold plates display fairly comparable thermal performance with more reduced system weight compared to the metallic cold plate.

Keywords

References

  1. Zhang, H. Y., Pinjala, D., Teo and Poi-Siong, 2003, Thermal management of high power dissipation electronic packages：from air cooling to liquid cooling, Electronics Packaging Technology Conference, Singapore, pp. 620-625
  2. Zhang, H. Y., Pinjala, D., Joshi, Y. K., Wong, T. N. and Toh, K. C., 2003, Thermal modeling and design of liquid cooled heat sinks assembled with flip chip ball grid array packages, Electronics Packaging Technology Conference, Singapore, pp. 432-437
  3. Chen, X. Y., Toh, K. C., Wong, T. N. and Chai, J. C., 2004, Direct liquid cooling of a stacked MCM, Inter Society Conference on thermal Phenomena, Las Vegas, pp. 199-206
  4. Chang, J. Y., Park, H. S., Jo, J. I. and Julia, S., 2006, A system design of liquid cooling computer based on the micro cooling technology, IT herm 2006, San Diego, pp. 157-160
  5. Zhang, H. Y., Pinjala, D., Wong, T. N., Toh, K. C. and Joshi, Y. K., 2005, Single phase liquid cooled microchannel heat sink for electronic packages, Applied Thermal Engineering, Vol. 25, pp. 1472-1487 https://doi.org/10.1016/j.applthermaleng.2004.09.014
  6. Zhang, H. Y., Pinjala, D., Wong, T. N., Toh, K. C. and Joshi, Y. K., 2005, Fluid flow and heat transfer in liquid cooled foam heat sinks for electronic packages, IEEE Transactions on Components And Packaging Technologies, Vol. 28, pp. 272-280 https://doi.org/10.1109/TCAPT.2005.848528
  7. Copeland, D., 2005, Review of low profile cold plate technology for high density servers, Electronics Cooling Online
  8. Copeland, D. W., 2003, Fundamental performance of heatsinks, ASME Journal of Electronic Packaging, Vol. 125, No. 2, pp. 221-225 https://doi.org/10.1115/1.1569262
  9. Harpole, G. M., and Eninger, J. E., 1991, Micro-channel heat exchanger optimization, Proceedings of the 7th IEEE Semi-Therm Symposium, Phoenix AZ, pp. 59-63
  10. Lee, H., Jeong, Y., Shin, J., Baek, J., Kang, M. and Chun, K., 2004, Package embedded heat exchanger for stacked multi-chip module, Sensors and Actuators A 114, pp. 204-211 https://doi.org/10.1016/j.sna.2003.12.026
  11. Holman, J. P., 2000, Experimental Method for Engineer, 7th ed., McGraw-Hill, pp. 51-60
  12. Incropera, Frank P. and DeWitt, David P., 2002, Fundamentals of Heat and Mass Transfer, 5th ed., John Willey and Sons