마이크로전자및패키징학회지 (Journal of the Microelectronics and Packaging Society)

  • 제15권4호
  • /
  • Pages.51-57
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  • 2008
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  • 1226-9360(pISSN)
  • /
  • 2287-7525(eISSN)
한국마이크로전자및패키징학회 (The Korean Microelectronics and Packaging Society)
권호 표지

플럭스 활성도 및 In 첨가에 따른 Sn-0.3Ag-0.7Cu 솔더 조성의 젖음 특성 변화

Wettability Evaluation of Sn-0.3Ag-0.7Cu Solder Alloy with Different Flux Activity and Indium Addition

  • 유아미 (한국생산기술연구원 용접.접합연구부/Microjoining Center) ;
  • 김준기 (한국생산기술연구원 용접.접합연구부/Microjoining Center) ;
  • 김목순 (인하대학교 신소재공학부) ;
  • 현창용 (서울산업대학교 신소재공학과) ;
  • 이종현 (서울산업대학교 신소재공학과)
  • Yu, A-Mi (Advanced Welding and Joining R&D Department/Microjoining Center, Korea Institute of Industrial Technology(KITECH)) ;
  • Kim, Jun-Ki (Advanced Welding and Joining R&D Department/Microjoining Center, Korea Institute of Industrial Technology(KITECH)) ;
  • Kim, Mok-Soon (School of Materials Science & Engineering, Inha University) ;
  • Hyun, Chang-Yong (Department of Materials Science & Engineering, Seoul National University of Technology) ;
  • Lee, Jong-Hyun (Department of Materials Science & Engineering, Seoul National University of Technology)
  • 발행 : 2008.12.31
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초록

저 Ag 함유 Sn-Ag-Cu계 무연솔더 조성, 즉, Sn-0.3Ag-0.7Cu 조성의 젖음 특성과 반응 특성을 Sn-1.0Ag-0.5Cu 및 Sn-3.0Ag-0.5Cu 합금 조성의 결과와 비교, 분석하였다. 또한 Sn-0.3Ag-0.7Cu 조성의 용융 특성을 시차주사열량계(differential scanning calorimeter, DSC)로 측정하고, 인장시험을 통한 응력-변형률 곡선을 관찰하였다. 아울러 Sn-0.3Ag-0.7Cu 조성의 젖음 특성을 향상시키기 위해 halide의 함유량이 많은 플럭스(flux)를 적용하거나 Sn-0.3Ag-0.7Cu 조성에 0.2wt.%의 In을 첨가하여 그 젖음 특성의 개선 정도를 분석해 보았다. 그 결과 halide 함유량이 높은 플럭스를 사용한 경우보다 미량의 In을 첨가한 경우가 $230{\sim}240^{\circ}C$의 저온 영역에서 wettability의 향상에 보다 효과적임을 관찰할 수 있었다.

In this paper, wetting and interfacial reaction properties for low Ag containing Sn-Ag-Cu Pb-free solder alloy, i.e., Sn-0.3Ag-0.7Cu were investigated and compared with those of Sn-1.0Ag-0.5Cu and Sn-3.0Ag-0.5Cu. Melting behavior and stress-strain curves of some Sn-xAg-xCu alloys were also measured using a differential scanning calorimeter(DSC) and a tensile test machine, respectively. In order to enhance insufficient wetting properties of Sn-0.3Ag-0.7Cu alloy, the improvement of wetting properties were analyzed by applying fluxes containing higher content of halide or indium adding of 0.2wt.% into the solder alloy. It was concluded that the small addition of indium is more effective for the improvement of wettability in low temperature range of $230{\sim}240^{\circ}C$ than applying flux containing higher content of halide.

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