DOI QR코드

DOI QR Code

초고속 디지털 회로의 GBN 억제를 위한 육각형 EBG 구조의 전원면 설계

A Novel Hexagonal EBG Power Plane for the Suppression of GBN in High-Speed Circuits

  • Kim, Seon-Hwa (Department of Electronic Engineering, Ajou University) ;
  • Joo, Sung-Ho (Department of Electronic Engineering, Ajou University) ;
  • Kim, Dong-Yeop (Department of Electronic Engineering, Ajou University) ;
  • Lee, Hai-Young (Department of Electronic Engineering, Ajou University)
  • 발행 : 2007.02.28

초록

본 논문에서는 초고속 디지털 PCB 회로에서 발생하는 GBN(Ground Bounce Noise)을 억제하기 위한 새로운 EBG(Electromagnetic Bandgap) 구조의 전원면을 제안하였다. 제안된 구조는 육각형 모양의 단위 셀과 각 셀을 연결하는 선로로 구성되어 있다. 육각형 모양의 단위 셀은 등방성을 띄어 인접 셀의 각 포트 사이의 전달 특성을 동일하게 한다. 제안된 구조는 실제 제작, 측정되었고 330 MHz부터 5.6 GHz까지 넓은 주파수 대역에서 -30 dB 이하로 GBN을 억제하는 특성을 나타낸다. Electromagnetic Interference(EMI) 방사 측정 시에도 일반 전원면/접지면에 비해 낮은 EMI 특성을 나타낸다. 본 논문에서 제안한 육각형 EBG 구조의 전원면은 실제 EBG 전원면의 적용에 효율적으로 작용하여 초고속 디지털 회로의 EMI 문제를 해결하는 데 기여할 것으로 기대된다.

In this paper, a novel hexagonal-shaped electromagnetic bandgap(EBG) power plane for the suppression of the ground bounce noise(GBN) in high-speed circuits is proposed. The proposed structure consists of hexagonal-shaped unit cells and detoured bridges connecting the unit cells. The hexagonal-shaped unit cells could omni-directionally suppress the GBN in digital circuits. The fabricated power plane's omni-directional -30 dB suppression bandwidth is from 330 MHz to 5.6 GHz. Then the proposed structure suppresses electromagnetic interference(EMI) caused by the GBN within the stopband. As a result, the proposed structure is expected to be conducive solving EMI problem in high-speed circuits.

키워드

참고문헌

  1. S. Van den Berghe, F. Olyslager, D. De Zutter, J. De Moerloose, and W.Temmerman, 'Study of the ground bounce caused by power plane resonances', IEEE Trans. Electromagnetic Compatibility, vol. 40, no. 2, pp. 111-119, May 1998 https://doi.org/10.1109/15.673616
  2. T. L. Wu, S. T. Chen, J. N. Huang, and Y. H. Lin, 'Numerical and experimental investigation of radiation caused by the switching noise on the partitioned DC reference planes of high speed digital PCB', IEEE Trans. Electromagnetic Compatibility, vol. 46, no. 1, pp. 33-45, Feb. 2004 https://doi.org/10.1109/TEMC.2004.823680
  3. R. Abhari, G. V. Eleftheriades, 'Metallo dielectric electromagnetic bandgap structures for suppression and isolation of the parallel-plate noise in highspeed circuits', IEEE Trans. Microwave Theory Techniques, vol. 51, pp. 1629-1639, Jun. 2003 https://doi.org/10.1109/TMTT.2003.812555
  4. Shahrooz Shahparnia, Omar M. Ramahi, 'Electromagnetic interference(EMI) reduction from printed circuit boards(PCB) using electromagnetic bandgap structures', IEEE Trans. Electromagnetic Compatibility, vol. 46, no. 4, pp. 580-587, Nov. 2004 https://doi.org/10.1109/TEMC.2004.837671
  5. T. Kamgaing, O. M. Ramahi, 'A novel power plane with integrated simultaneous switching noise mitigation capability using high impedance surface', IEEE Microwave Wireless Components Letters, vol. 13, pp. 21-23, Jan. 2003 https://doi.org/10.1109/LMWC.2002.807713
  6. T. L. Wu, Y. H. Lin, and S. T. Chen, 'A novel power planes with low radiation and broadband suppression of ground bounce noise using photonic bandgap structures', IEEE Microwave Wireless Components Letters, vol. 14, no. 7, pp. 337-339, Jul. 2004 https://doi.org/10.1109/LMWC.2004.829275
  7. 주성호, 김동엽, 이해영, '초고속 디지털 회로의 GBN 억제를 위한 Power Plane 설계', 마이크로파 및 전파 학술대회 논문집, 29(2), pp. 343-346, 2006년 9월
  8. Tzong-Lin Wu, Yen-Hui Lin, Ting-Kuang Wang, Chein-Chung Wang, and Sin-Ting Chen, 'Electromagntic bandgap power/ground planes for wideband suppression of ground bounce noise and radiated emission in high-speed circuits', IEEE Trans. Microwave Theory and Techniques, vol. 40, no. 2, pp. 2935-2942, Sep. 2005