마이크로전자및패키징학회지 (Journal of the Microelectronics and Packaging Society)
- 제14권4호
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- Pages.71-77
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- 2007
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- 1226-9360(pISSN)
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- 2287-7525(eISSN)
BGA 솔더 접합부의 기계적.전기적 특성에 미치는 리플로우 횟수의 효과
Effect of Reflow Number on Mechanical and Electrical Properties of Ball Grid Array (BGA) Solder Joints
- Koo, Ja-Myeong (School of Advanced Materials Science and Engineering, Sungkyunkwan University) ;
- Lee, Chang-Yong (School of Advanced Materials Science and Engineering, Sungkyunkwan University) ;
- Jung, Seung-Boo (School of Advanced Materials Science and Engineering, Sungkyunkwan University)
- 발행 : 2007.12.30
초록
본 연구에서는 리플로우 횟수를 달리하여 Sn-37Pb, Sn-3.5Ag와 Sn-3.5Ag-0.75Cu (all wt.%) BGA 솔더 접합부들을 OSP가 코팅된 Cu 패드 상에 형성시킨 후, 기계적 전기적 특성을 연구하였다. 주사전자현미경 분석 결과, 접합 계면에 생성된
In this study, the mechanical and electrical properties of three different ball grid array (BGA) solder joints, consisting of Sn-37Pb, Sn-3.5Ag and Sn-3.5Ag-0.75Cu (all wt.%), with organic solderability preservative (OSP)-finished Cu pads were investigated as a function of reflow number. Based on scanning electron microscopy (SEM) analysis results, a continuous
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